IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
614-91-316-31-007000

614-91-316-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-316-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-91-642-41-001000

115-91-642-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0 -
115-91-642-41-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-93-310-41-003000

126-93-310-41-003000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-310-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-310-41-003000

126-43-310-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-310-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-93-308-41-002000

124-93-308-41-002000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

0 -
124-93-308-41-002000

数据表

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-43-308-41-002000

124-43-308-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-43-308-41-002000

数据表

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-93-314-41-001000

126-93-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-314-41-001000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-314-41-001000

126-43-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-314-41-001000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0528-T-H

APH-0528-T-H

APH-0528-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1828-T-H

APH-1828-T-H

APH-1828-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1028-T-H

APH-1028-T-H

APH-1028-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1928-T-H

APH-1928-T-H

APH-1928-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1128-T-H

APH-1128-T-H

APH-1128-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1228-T-H

APH-1228-T-H

APH-1228-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0328-T-H

APH-0328-T-H

APH-0328-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0828-T-H

APH-0828-T-H

APH-0828-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1328-T-H

APH-1328-T-H

APH-1328-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
126-41-316-41-001000

126-41-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-316-41-001000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-316-41-001000

126-91-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-316-41-001000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-628-41-605000

110-93-628-41-605000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-628-41-605000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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