IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
33-0501-30

33-0501-30

CONN SOCKET SIP 33POS TIN

Aries Electronics

0 -
33-0501-30

数据表

501 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
317-93-108-41-005000

317-93-108-41-005000

SHRINK DIP SOCKET 8 PIN

Mill-Max Manufacturing Corp.

0 -

-

317 Tube Active SIP 8 (1 x 8) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
517-87-293-18-101111

517-87-293-18-101111

CONN SOCKET PGA 293POS GOLD

Preci-Dip

0 -
517-87-293-18-101111

数据表

517 Bulk Active PGA 293 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
40-9513-11

40-9513-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-9513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-13-322-41-001000

110-13-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-13-322-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-422-41-001000

110-13-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-13-422-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
26-81250-310C

26-81250-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-81250-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
26-81250-610C

26-81250-610C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-81250-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
26-8350-310C

26-8350-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-8350-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
26-8530-310C

26-8530-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-8530-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
26-8900-310C

26-8900-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-8900-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
26-8975-310C

26-8975-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-8975-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
26-8984-310C

26-8984-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-8984-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APH-0428-T-R

APH-0428-T-R

APH-0428-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1828-T-R

APH-1828-T-R

APH-1828-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0528-T-R

APH-0528-T-R

APH-0528-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1428-T-R

APH-1428-T-R

APH-1428-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1528-T-R

APH-1528-T-R

APH-1528-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1928-T-R

APH-1928-T-R

APH-1928-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0628-T-R

APH-0628-T-R

APH-0628-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
深圳市宝利科技有限公司

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