IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
612-91-318-41-003000

612-91-318-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-318-41-003000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-147-31-018000

714-43-147-31-018000

CONN SOCKET SIP 47POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-147-31-018000

数据表

714 Bulk Active SIP 47 (1 x 47) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-99-132-41-012000

346-99-132-41-012000

SOCKET SLDRLSS PRESSFIT SIP32POS

Mill-Max Manufacturing Corp.

0 -
346-99-132-41-012000

数据表

346 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-318-41-770000

104-13-318-41-770000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-318-41-770000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
517-87-304-14-051111

517-87-304-14-051111

CONN SOCKET PGA 304POS GOLD

Preci-Dip

0 -
517-87-304-14-051111

数据表

517 Bulk Active PGA 304 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-632-AGG

ICA-632-AGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-632-AGG

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0314-T-12

HLS-0314-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0314-T-12

数据表

HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
110-47-648-41-105000

110-47-648-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
110-47-648-41-105000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0430-T-H

APH-0430-T-H

APH-0430-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0930-T-H

APH-0930-T-H

APH-0930-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1430-T-H

APH-1430-T-H

APH-1430-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1030-T-H

APH-1030-T-H

APH-1030-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0630-T-H

APH-0630-T-H

APH-0630-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0830-T-H

APH-0830-T-H

APH-0830-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0730-T-H

APH-0730-T-H

APH-0730-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0230-T-H

APH-0230-T-H

APH-0230-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0330-T-H

APH-0330-T-H

APH-0330-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
116-47-636-41-006000

116-47-636-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-636-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-324-31-012000

614-41-324-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-324-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-424-31-012000

614-41-424-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-424-31-012000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户