IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
38-3513-11H

38-3513-11H

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0 -
38-3513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APH-1512-G-R

APH-1512-G-R

APH-1512-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1012-G-R

APH-1012-G-R

APH-1012-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0512-G-R

APH-0512-G-R

APH-0512-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1912-G-R

APH-1912-G-R

APH-1912-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0612-G-R

APH-0612-G-R

APH-0612-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1112-G-R

APH-1112-G-R

APH-1112-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0312-G-R

APH-0312-G-R

APH-0312-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0712-G-R

APH-0712-G-R

APH-0712-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0412-G-R

APH-0412-G-R

APH-0412-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1612-G-R

APH-1612-G-R

APH-1612-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0812-G-R

APH-0812-G-R

APH-0812-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1712-G-R

APH-1712-G-R

APH-1712-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1212-G-R

APH-1212-G-R

APH-1212-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
210-11-632-41-001000

210-11-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-11-632-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-93-432-41-117000

114-93-432-41-117000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
114-93-432-41-117000

数据表

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-93-632-41-117000

114-93-632-41-117000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
114-93-632-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-43-432-41-117000

114-43-432-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-43-432-41-117000

数据表

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-43-632-41-117000

114-43-632-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-43-632-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-93-161-41-013000

346-93-161-41-013000

CONN SOCKET SIP 61POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-161-41-013000

数据表

346 Bulk Active SIP 61 (1 x 61) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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