IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1032-T-T

APH-1032-T-T

APH-1032-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1532-T-T

APH-1532-T-T

APH-1532-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1632-T-T

APH-1632-T-T

APH-1632-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1332-T-T

APH-1332-T-T

APH-1332-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1732-T-T

APH-1732-T-T

APH-1732-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
115-93-636-41-001000

115-93-636-41-001000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-93-636-41-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-636-41-001000

115-43-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-636-41-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-148-31-018000

714-43-148-31-018000

CONN SOCKET SIP 48POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-148-31-018000

数据表

714 Bulk Active SIP 48 (1 x 48) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-41-640-41-005000

117-41-640-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-41-640-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-91-640-41-005000

117-91-640-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-91-640-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-320-41-001000

614-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
614-93-320-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-420-41-001000

614-93-420-41-001000

SOCKET CARRIER LOWPRO .400 20POS

Mill-Max Manufacturing Corp.

0 -
614-93-420-41-001000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-320-41-001000

614-43-320-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-320-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-420-41-001000

614-43-420-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-420-41-001000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210793-4

210793-4

CONN SOCKET PGA 132POS GOLD

TE Connectivity AMP Connectors

0 -
210793-4

数据表

PKA Tube Obsolete PGA 132 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Thermoplastic, Polyester, Glass Filled -
ICA-632-ZHGT

ICA-632-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-632-ZHGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0314-T-11

HLS-0314-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0314-T-11

数据表

HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
111-41-650-41-001000

111-41-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-650-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-91-650-41-001000

111-91-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-650-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-432-41-003000

116-41-432-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-432-41-003000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户