IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0434-T-T

APH-0434-T-T

APH-0434-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0730-T-R

APH-0730-T-R

APH-0730-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0330-T-R

APH-0330-T-R

APH-0330-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
HLS-0219-G-22

HLS-0219-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0219-G-22

数据表

HLS Tube Active SIP 38 (2 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
104-13-320-41-780000

104-13-320-41-780000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-320-41-780000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
104-13-420-41-780000

104-13-420-41-780000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-420-41-780000

数据表

104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
HLS-0312-G-30

HLS-0312-G-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0312-G-30

数据表

HLS Tube Active SIP 36 (3 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
614-93-322-31-018000

614-93-322-31-018000

SOCKET CARRIER LOWPRO .300 22POS

Mill-Max Manufacturing Corp.

0 -
614-93-322-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-422-31-018000

614-93-422-31-018000

SOCKET CARRIER LOWPRO .400 22POS

Mill-Max Manufacturing Corp.

0 -
614-93-422-31-018000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-322-31-018000

614-43-322-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-322-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-422-31-018000

614-43-422-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-422-31-018000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-648-ZWGT-3

ICA-648-ZWGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-ZWGT-3

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
18-3503-31

18-3503-31

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-3503-31

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
104-13-318-41-780000

104-13-318-41-780000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-318-41-780000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
124-41-316-41-002000

124-41-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-41-316-41-002000

数据表

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-316-41-002000

124-91-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-91-316-41-002000

数据表

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1024-T-H

APH-1024-T-H

APH-1024-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0624-T-H

APH-0624-T-H

APH-0624-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1224-T-H

APH-1224-T-H

APH-1224-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1824-T-H

APH-1824-T-H

APH-1824-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
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