IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1934-T-R

APH-1934-T-R

APH-1934-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0234-T-R

APH-0234-T-R

APH-0234-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1634-T-R

APH-1634-T-R

APH-1634-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0434-T-R

APH-0434-T-R

APH-0434-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0334-T-R

APH-0334-T-R

APH-0334-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1234-T-R

APH-1234-T-R

APH-1234-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0634-T-R

APH-0634-T-R

APH-0634-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0734-T-R

APH-0734-T-R

APH-0734-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0834-T-R

APH-0834-T-R

APH-0834-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
116-47-328-41-001000

116-47-328-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-328-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-47-428-41-001000

116-47-428-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-428-41-001000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-47-628-41-001000

116-47-628-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-628-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-41-640-41-013000

146-41-640-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-41-640-41-013000

数据表

146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-91-640-41-013000

146-91-640-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-91-640-41-013000

数据表

146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-47-640-41-007000

116-47-640-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-640-41-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-322-41-003000

612-43-322-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-322-41-003000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-422-41-003000

612-43-422-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-422-41-003000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-93-322-41-003000

612-93-322-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-322-41-003000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-93-422-41-003000

612-93-422-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-422-41-003000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-47-432-41-001000

123-47-432-41-001000

STANDARD WIRE WRAP DBL SKT

Mill-Max Manufacturing Corp.

0 -
123-47-432-41-001000

数据表

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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