IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
117-41-652-41-005000

117-41-652-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-41-652-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-91-652-41-005000

117-91-652-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-91-652-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-13-318-41-001000

122-13-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-318-41-001000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-328-41-008000

116-93-328-41-008000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-328-41-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-428-41-008000

116-93-428-41-008000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-428-41-008000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-628-41-008000

116-93-628-41-008000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-628-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-328-41-008000

116-43-328-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-328-41-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-428-41-008000

116-43-428-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-428-41-008000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-628-41-008000

116-43-628-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-628-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1436-T-H

APH-1436-T-H

APH-1436-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1536-T-H

APH-1536-T-H

APH-1536-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0336-T-H

APH-0336-T-H

APH-0336-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0736-T-H

APH-0736-T-H

APH-0736-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0236-T-H

APH-0236-T-H

APH-0236-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0636-T-H

APH-0636-T-H

APH-0636-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1136-T-H

APH-1136-T-H

APH-1136-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1336-T-H

APH-1336-T-H

APH-1336-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0436-T-H

APH-0436-T-H

APH-0436-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1236-T-H

APH-1236-T-H

APH-1236-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
34-0501-21

34-0501-21

CONN SOCKET SIP 34POS GOLD

Aries Electronics

0 -
34-0501-21

数据表

501 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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