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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
612-91-428-41-003000

612-91-428-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-428-41-003000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-91-628-41-003000

612-91-628-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-628-41-003000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-11-322-41-001000

612-11-322-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-11-322-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-11-422-41-001000

612-11-422-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-11-422-41-001000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-328-41-770000

104-13-328-41-770000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-328-41-770000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
104-13-428-41-770000

104-13-428-41-770000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-428-41-770000

数据表

104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
104-13-628-41-770000

104-13-628-41-770000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-628-41-770000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
40-7350-10

40-7350-10

CONN SOCKET SIP 40POS TIN

Aries Electronics

0 -
40-7350-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
37-PGM10012-11

37-PGM10012-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
37-PGM10012-11

数据表

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
111-93-650-41-001000

111-93-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
111-93-650-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-43-650-41-001000

111-43-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-650-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-93-132-41-013000

346-93-132-41-013000

SOCKET SLDRLSS PRESSFIT SIP32POS

Mill-Max Manufacturing Corp.

0 -
346-93-132-41-013000

数据表

346 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-41-950-41-001000

111-41-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-950-41-001000

数据表

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-91-950-41-001000

111-91-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-950-41-001000

数据表

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0311-G-32

HLS-0311-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0311-G-32

数据表

HLS Tube Active SIP 33 (3 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
110-11-648-41-001000

110-11-648-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-11-648-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-328-61-001000

110-43-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-628-61-001000

110-91-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-328-61-001000

110-99-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-628-61-001000

110-99-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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