IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
114-93-650-41-117000

114-93-650-41-117000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
114-93-650-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-43-650-41-117000

114-43-650-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-43-650-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1816-G-T

APH-1816-G-T

APH-1816-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0916-G-T

APH-0916-G-T

APH-0916-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1116-G-T

APH-1116-G-T

APH-1116-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0416-G-T

APH-0416-G-T

APH-0416-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1216-G-T

APH-1216-G-T

APH-1216-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0316-G-T

APH-0316-G-T

APH-0316-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0716-G-T

APH-0716-G-T

APH-0716-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1716-G-T

APH-1716-G-T

APH-1716-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
217-91-764-41-005000

217-91-764-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
217-91-764-41-005000

数据表

217 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-648-WGT-3

ICA-648-WGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-WGT-3

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
38-6823-90

38-6823-90

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0 -
38-6823-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
116-93-636-41-003000

116-93-636-41-003000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-636-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-636-41-003000

116-43-636-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-636-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-156-31-018000

714-43-156-31-018000

CONN SOCKET SIP 56POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-156-31-018000

数据表

714 Bulk Active SIP 56 (1 x 56) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-328-41-001000

614-93-328-41-001000

SOCKET CARRIER LOWPRO .300 28POS

Mill-Max Manufacturing Corp.

0 -
614-93-328-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-428-41-001000

614-93-428-41-001000

SOCKET CARRIER LOWPRO .400 28POS

Mill-Max Manufacturing Corp.

0 -
614-93-428-41-001000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-628-41-001000

614-93-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
614-93-628-41-001000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-328-41-001000

614-43-328-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-328-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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