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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
36-6556-20

36-6556-20

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-6556-20

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
30-6621-30

30-6621-30

CONN IC DIP SOCKET 30POS TIN

Aries Electronics

0 -
30-6621-30

数据表

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-7950-10

40-7950-10

CONN SOCKET SIP 40POS TIN

Aries Electronics

0 -
40-7950-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-41-636-31-002000

614-41-636-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-636-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-636-31-002000

614-91-636-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-636-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-47-650-41-007000

116-47-650-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-650-41-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-636-31-007000

614-41-636-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-636-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-636-31-007000

614-91-636-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-636-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-318-G-Q

APA-318-G-Q

ADAPTER PLUG

Samtec Inc.

0 -
APA-318-G-Q

数据表

APA Tube Active - 18 (2 x 9) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
40-3575-10

40-3575-10

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

0 -
40-3575-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
40-6571-10

40-6571-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-6571-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
40-6573-10

40-6573-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-6573-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
40-6575-10

40-6575-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-6575-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
HLS-0414-S-2

HLS-0414-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0414-S-2

数据表

HLS Bulk Active SIP 56 (4 x 14) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
32-6575-10

32-6575-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

0 -
32-6575-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-6574-10

32-6574-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

0 -
32-6574-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
126-41-636-41-001000

126-41-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-636-41-001000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-636-41-001000

126-91-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-636-41-001000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
517-87-364-17-091111

517-87-364-17-091111

CONN SOCKET PGA 364POS GOLD

Preci-Dip

0 -
517-87-364-17-091111

数据表

517 Bulk Active PGA 364 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
28-8350-610C

28-8350-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-8350-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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