IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0316-G-H

APH-0316-G-H

APH-0316-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0816-G-H

APH-0816-G-H

APH-0816-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1216-G-H

APH-1216-G-H

APH-1216-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
117-41-640-41-105000

117-41-640-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-41-640-41-105000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-432-41-002000

126-41-432-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-432-41-002000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-632-41-002000

126-41-632-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-632-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-432-41-002000

126-91-432-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-432-41-002000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-632-41-002000

126-91-632-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-632-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-158-31-018000

714-43-158-31-018000

CONN SOCKET SIP 58POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-158-31-018000

数据表

714 Bulk Active SIP 58 (1 x 58) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-47-668-41-005000

117-47-668-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
117-47-668-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-87-178-18-111135

546-87-178-18-111135

CONN SOCKET PGA 178POS GOLD

Preci-Dip

0 -
546-87-178-18-111135

数据表

546 Bulk Active PGA 178 (18 x 18) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-93-648-41-005000

117-93-648-41-005000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

0 -
117-93-648-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-PGM13009-10

124-PGM13009-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
124-PGM13009-10

数据表

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
550-10-100-15-001101

550-10-100-15-001101

PGA SOLDER TAIL

Preci-Dip

0 -
550-10-100-15-001101

数据表

550 Bulk Active PGA 100 (15 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
33-0501-21

33-0501-21

CONN SOCKET SIP 33POS GOLD

Aries Electronics

0 -
33-0501-21

数据表

501 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
35-0501-20

35-0501-20

CONN SOCKET SIP 35POS TIN

Aries Electronics

0 -
35-0501-20

数据表

501 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
35-0501-30

35-0501-30

CONN SOCKET SIP 35POS TIN

Aries Electronics

0 -
35-0501-30

数据表

501 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-91-640-31-012000

614-91-640-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-640-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-13-324-41-001000

122-13-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-324-41-001000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-13-424-41-001000

122-13-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-424-41-001000

数据表

122 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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