IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-11-950-41-001000

110-11-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-11-950-41-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0417-T-2

HLS-0417-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0417-T-2

数据表

HLS Bulk Active SIP 68 (4 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
APH-1340-T-H

APH-1340-T-H

APH-1340-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0840-T-H

APH-0840-T-H

APH-0840-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1440-T-H

APH-1440-T-H

APH-1440-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0440-T-H

APH-0440-T-H

APH-0440-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1840-T-H

APH-1840-T-H

APH-1840-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1540-T-H

APH-1540-T-H

APH-1540-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1040-T-H

APH-1040-T-H

APH-1040-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1740-T-H

APH-1740-T-H

APH-1740-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1640-T-H

APH-1640-T-H

APH-1640-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
110-43-306-61-001000

110-43-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-306-61-001000

110-44-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
25-0511-11

25-0511-11

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0 -
25-0511-11

数据表

511 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
123-13-322-41-001000

123-13-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-322-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-13-422-41-001000

123-13-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-422-41-001000

数据表

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-308-61-001000

110-43-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-43-308-61-001000

111-43-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-93-308-61-001000

111-93-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-308-61-003000

115-93-308-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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