IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
60-9513-11H

60-9513-11H

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

0 -
60-9513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APH-0432-T-R

APH-0432-T-R

APH-0432-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1832-T-R

APH-1832-T-R

APH-1832-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0932-T-R

APH-0932-T-R

APH-0932-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1032-T-R

APH-1032-T-R

APH-1032-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1932-T-R

APH-1932-T-R

APH-1932-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0632-T-R

APH-0632-T-R

APH-0632-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1632-T-R

APH-1632-T-R

APH-1632-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1232-T-R

APH-1232-T-R

APH-1232-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1132-T-R

APH-1132-T-R

APH-1132-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
614-41-648-31-012000

614-41-648-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-648-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-648-31-012000

614-91-648-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-648-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-650-41-003000

116-93-650-41-003000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-650-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-650-41-003000

116-43-650-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-650-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-87-192-14-001135

546-87-192-14-001135

CONN SOCKET PGA 192POS GOLD

Preci-Dip

0 -
546-87-192-14-001135

数据表

546 Bulk Active PGA 192 (14 x 14) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-192-14-001136

546-87-192-14-001136

CONN SOCKET PGA 192POS GOLD

Preci-Dip

0 -
546-87-192-14-001136

数据表

546 Bulk Active PGA 192 (14 x 14) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APO-422-G-R

APO-422-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-422-G-R

数据表

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
116-93-642-41-008000

116-93-642-41-008000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-642-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-642-41-008000

116-43-642-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-642-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-41-642-41-001000

612-41-642-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-642-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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