IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
612-11-632-41-001000

612-11-632-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-11-632-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APO-422-G-C

APO-422-G-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-422-G-C

数据表

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
514-87-321-19-121154

514-87-321-19-121154

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
514-87-321-19-121154

数据表

514 Bulk Active PGA 321 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-41-650-31-018000

614-41-650-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-650-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-650-31-018000

614-91-650-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-650-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0918-G-H

APH-0918-G-H

APH-0918-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1418-G-H

APH-1418-G-H

APH-1418-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1918-G-H

APH-1918-G-H

APH-1918-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0518-G-H

APH-0518-G-H

APH-0518-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0618-G-H

APH-0618-G-H

APH-0618-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1118-G-H

APH-1118-G-H

APH-1118-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1618-G-H

APH-1618-G-H

APH-1618-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1218-G-H

APH-1218-G-H

APH-1218-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1318-G-H

APH-1318-G-H

APH-1318-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0418-G-H

APH-0418-G-H

APH-0418-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0318-G-H

APH-0318-G-H

APH-0318-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
116-47-648-41-001000

116-47-648-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-648-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
321-13-132-41-001000

321-13-132-41-001000

SOCKET 1 LEVEL WRAPOST SIP 32POS

Mill-Max Manufacturing Corp.

0 -
321-13-132-41-001000

数据表

321 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-950-31-012000

614-41-950-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-950-31-012000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-950-31-012000

614-91-950-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-950-31-012000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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