IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
32-3553-11

32-3553-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

0 -
32-3553-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-6551-11

32-6551-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

0 -
32-6551-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-6552-11

32-6552-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

0 -
32-6552-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-3554-11

32-3554-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

0 -
32-3554-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
614-93-648-31-007000

614-93-648-31-007000

SOCKET CARRIER LOWPRO .600 48POS

Mill-Max Manufacturing Corp.

0 -
614-93-648-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-648-31-007000

614-43-648-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-648-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-640-CGG

ICO-640-CGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-CGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
104-13-642-41-780000

104-13-642-41-780000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-642-41-780000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
APH-0534-T-R

APH-0534-T-R

APH-0534-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1434-T-R

APH-1434-T-R

APH-1434-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1034-T-R

APH-1034-T-R

APH-1034-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1534-T-R

APH-1534-T-R

APH-1534-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1134-T-R

APH-1134-T-R

APH-1134-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
126-41-636-41-003000

126-41-636-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-636-41-003000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-636-41-003000

126-91-636-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-636-41-003000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
326-93-132-41-002000

326-93-132-41-002000

SOCKET WRAP SOLDERTAIL SIP 32POS

Mill-Max Manufacturing Corp.

0 -
326-93-132-41-002000

数据表

326 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-640-41-001000

116-93-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-640-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-640-41-001000

116-43-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-640-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-952-31-002000

614-41-952-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-952-31-002000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-952-31-002000

614-91-952-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-952-31-002000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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