IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
115-93-964-41-001000

115-93-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-93-964-41-001000

数据表

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-964-41-001000

115-43-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-964-41-001000

数据表

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-648-CGG

ICO-648-CGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-648-CGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
712-13-132-41-001000

712-13-132-41-001000

SOCKET CARRIER SIP 32POS

Mill-Max Manufacturing Corp.

0 -
712-13-132-41-001000

数据表

712 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-636-61-001000

110-44-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-636-61-001000

110-99-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-308-61-008000

116-93-308-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-13-328-41-001000

123-13-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-328-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-13-428-41-001000

123-13-428-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-428-41-001000

数据表

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-44-422-61-003000

115-44-422-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8080-1G1-LF

8080-1G1-LF

CONN TRANSIST TO-3 3POS TIN

TE Connectivity AMP Connectors

0 -
8080-1G1-LF

数据表

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
APH-1818-G-R

APH-1818-G-R

APH-1818-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0918-G-R

APH-0918-G-R

APH-0918-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1418-G-R

APH-1418-G-R

APH-1418-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1918-G-R

APH-1918-G-R

APH-1918-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0518-G-R

APH-0518-G-R

APH-0518-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1518-G-R

APH-1518-G-R

APH-1518-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0618-G-R

APH-0618-G-R

APH-0618-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1118-G-R

APH-1118-G-R

APH-1118-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0718-G-R

APH-0718-G-R

APH-0718-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
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