IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
2-822114-4

2-822114-4

CONN SOCKET PQFP 160POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
2-822114-4

数据表

- Tube Obsolete QFP 160 (4 x 40) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
122-11-640-41-001000

122-11-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-640-41-001000

数据表

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1051420133

1051420133

CONN SOCKET LGA 2011POS GOLD

Molex

0 -
1051420133

数据表

105142 Tray Obsolete LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - - Thermoplastic -
115-44-636-61-003000

115-44-636-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-650-61-001000

110-44-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-636-41-004000

612-43-636-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-636-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-93-636-41-004000

612-93-636-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-636-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6621-30

40-6621-30

CONN IC DIP SOCKET 40POS TIN

Aries Electronics

0 -
40-6621-30

数据表

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
612-41-950-41-001000

612-41-950-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-950-41-001000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-91-950-41-001000

612-91-950-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-950-41-001000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
42-3570-10

42-3570-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

0 -
42-3570-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
110-43-318-61-105000

110-43-318-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
48-6823-90T

48-6823-90T

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

0 -
48-6823-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
110-91-636-61-001000

110-91-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-44-428-61-003000

115-44-428-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-11-636-41-001000

612-11-636-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-11-636-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
121-13-640-41-001000

121-13-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
121-13-640-41-001000

数据表

121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
30-3503-21

30-3503-21

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-3503-21

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
30-3503-31

30-3503-31

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-3503-31

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
612-41-650-41-003000

612-41-650-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-650-41-003000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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