IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
123-93-632-41-801000

123-93-632-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-93-632-41-801000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-11-642-41-001000

122-11-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-642-41-001000

数据表

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-210-61-001000

115-93-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

115 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1916-G-T

APH-1916-G-T

APH-1916-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1416-G-T

APH-1416-G-T

APH-1416-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0516-G-T

APH-0516-G-T

APH-0516-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1516-G-T

APH-1516-G-T

APH-1516-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0616-G-T

APH-0616-G-T

APH-0616-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0216-G-T

APH-0216-G-T

APH-0216-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0816-G-T

APH-0816-G-T

APH-0816-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1616-G-T

APH-1616-G-T

APH-1616-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
110-44-420-61-001000

110-44-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-952-41-008000

116-41-952-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-952-41-008000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-952-41-008000

116-91-952-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-952-41-008000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-11-640-41-001000

612-11-640-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-11-640-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-44-314-61-003000

115-44-314-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
550-10-121-13-061101

550-10-121-13-061101

PGA SOLDER TAIL

Preci-Dip

0 -
550-10-121-13-061101

数据表

550 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0315-G-12

HLS-0315-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0315-G-12

数据表

HLS Tube Active SIP 45 (3 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
514-87-223-18-091117

514-87-223-18-091117

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
514-87-223-18-091117

数据表

514 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
36-0501-21

36-0501-21

CONN SOCKET SIP 36POS GOLD

Aries Electronics

0 -
36-0501-21

数据表

501 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户