IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
111-43-628-61-001000

111-43-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

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111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-93-328-61-001000

111-93-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-93-428-61-001000

111-93-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-93-628-61-001000

111-93-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
36-6503-21

36-6503-21

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-6503-21

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
116-43-640-61-006000

116-43-640-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-11-952-41-001000

612-11-952-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-11-952-41-001000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0524-G-T

APH-0524-G-T

APH-0524-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1124-G-T

APH-1124-G-T

APH-1124-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1624-G-T

APH-1624-G-T

APH-1624-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0724-G-T

APH-0724-G-T

APH-0724-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1824-G-T

APH-1824-G-T

APH-1824-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1324-G-T

APH-1324-G-T

APH-1324-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0824-G-T

APH-0824-G-T

APH-0824-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0224-G-T

APH-0224-G-T

APH-0224-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1724-G-T

APH-1724-G-T

APH-1724-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
323-93-164-41-001000

323-93-164-41-001000

SOCKET 3 LEVEL WRAPOST SIP 64POS

Mill-Max Manufacturing Corp.

0 -
323-93-164-41-001000

数据表

323 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-C300-31

28-C300-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-C300-31

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
121-11-952-41-001000

121-11-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-952-41-001000

数据表

121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-93-132-14-071001

510-93-132-14-071001

PGA SOCK 132PIN 14X14 SOLDER TL

Mill-Max Manufacturing Corp.

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-

510 Tube Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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