IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
510-93-132-13-041001

510-93-132-13-041001

SOCKET SOLDERTAIL 132-PGA

Mill-Max Manufacturing Corp.

0 -

-

510 Tube Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-43-132-13-041001

510-43-132-13-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-43-132-13-041001

数据表

510 Tube Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
517-83-361-18-101111

517-83-361-18-101111

CONN SOCKET PGA 361POS GOLD

Preci-Dip

0 -
517-83-361-18-101111

数据表

517 Bulk Active PGA 361 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0426-G-H

APH-0426-G-H

APH-0426-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0926-G-H

APH-0926-G-H

APH-0926-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1426-G-H

APH-1426-G-H

APH-1426-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1026-G-H

APH-1026-G-H

APH-1026-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0626-G-H

APH-0626-G-H

APH-0626-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1626-G-H

APH-1626-G-H

APH-1626-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1126-G-H

APH-1126-G-H

APH-1126-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1726-G-H

APH-1726-G-H

APH-1726-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0726-G-H

APH-0726-G-H

APH-0726-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
517-87-545-17-000111

517-87-545-17-000111

CONN SOCKET PGA 545POS GOLD

Preci-Dip

0 -
517-87-545-17-000111

数据表

517 Bulk Active PGA 545 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-93-952-61-001000

115-93-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-43-640-61-001000

111-43-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-93-640-61-001000

111-93-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-648-G-M

APA-648-G-M

ADAPTER PLUG

Samtec Inc.

0 -
APA-648-G-M

数据表

APA Tube Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
32-6570-11

32-6570-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

0 -
32-6570-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-4508-31

24-4508-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-4508-31

数据表

508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
123-13-648-41-001000

123-13-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-648-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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