IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
36-6556-21

36-6556-21

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-6556-21

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
APH-0428-G-H

APH-0428-G-H

APH-0428-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0928-G-H

APH-0928-G-H

APH-0928-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1428-G-H

APH-1428-G-H

APH-1428-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1528-G-H

APH-1528-G-H

APH-1528-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1928-G-H

APH-1928-G-H

APH-1928-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0628-G-H

APH-0628-G-H

APH-0628-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1228-G-H

APH-1228-G-H

APH-1228-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0728-G-H

APH-0728-G-H

APH-0728-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0828-G-H

APH-0828-G-H

APH-0828-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0328-G-H

APH-0328-G-H

APH-0328-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1828-G-H

APH-1828-G-H

APH-1828-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1128-G-H

APH-1128-G-H

APH-1128-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1728-G-H

APH-1728-G-H

APH-1728-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
110-13-632-61-801000

110-13-632-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-320-61-801000

110-13-320-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-964-41-004000

612-43-964-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-964-41-004000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-93-964-41-004000

612-93-964-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-964-41-004000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-91-097-11-041003

510-91-097-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-91-097-11-041003

数据表

510 Bulk Active PGA 97 (11 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-83-223-18-091135

546-83-223-18-091135

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
546-83-223-18-091135

数据表

546 Bulk Active PGA 223 (18 x 18) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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