IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1732-G-T

APH-1732-G-T

APH-1732-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APO-640-G-T

APO-640-G-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-640-G-T

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
HLS-0316-G-32

HLS-0316-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0316-G-32

数据表

HLS Tube Active SIP 48 (3 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
714-43-260-31-018000

714-43-260-31-018000

CONN IC DIP SOCKET 60POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-260-31-018000

数据表

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0924-G-T

APH-0924-G-T

APH-0924-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1424-G-T

APH-1424-G-T

APH-1424-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1924-G-T

APH-1924-G-T

APH-1924-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1524-G-T

APH-1524-G-T

APH-1524-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0624-G-T

APH-0624-G-T

APH-0624-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1224-G-T

APH-1224-G-T

APH-1224-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0424-G-T

APH-0424-G-T

APH-0424-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0324-G-T

APH-0324-G-T

APH-0324-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
546-87-304-14-051147

546-87-304-14-051147

CONN SOCKET PGA 304POS GOLD

Preci-Dip

0 -
546-87-304-14-051147

数据表

546 Bulk Active PGA 304 (14 x 14) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0420-G-2

HLS-0420-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0420-G-2

数据表

HLS Bulk Active SIP 80 (4 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
HLS-0512-T-18

HLS-0512-T-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0512-T-18

数据表

HLS Bulk Active SIP 60 (5 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
40-C182-21

40-C182-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C182-21

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
40-C182-31

40-C182-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C182-31

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
40-C212-21

40-C212-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C212-21

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
40-C212-31

40-C212-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C212-31

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
40-C300-31

40-C300-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C300-31

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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