IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1836-G-H

APH-1836-G-H

APH-1836-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1536-G-H

APH-1536-G-H

APH-1536-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0636-G-H

APH-0636-G-H

APH-0636-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
255-7322-01-0602

255-7322-01-0602

3M TEXTOOL ZIP STRIP SOCKETS 255

3M

0 -

-

Textool™ Box Obsolete - - - - - - - - - - - - - - -
255-7322-02-0602

255-7322-02-0602

3M TEXTOOL ZIP STRIP SOCKETS 255

3M

0 -

-

Textool™ Box Obsolete - - - - - - - - - - - - - - -
514-87-388M26-001148

514-87-388M26-001148

CONN SOCKET BGA 388POS GOLD

Preci-Dip

0 -
514-87-388M26-001148

数据表

514 Bulk Active BGA 388 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-279-19-081112

614-83-279-19-081112

CONN SOCKET PGA 279POS GOLD

Preci-Dip

0 -
614-83-279-19-081112

数据表

614 Bulk Active PGA 279 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-83-320-19-131147

546-83-320-19-131147

CONN SOCKET PGA 320POS GOLD

Preci-Dip

0 -
546-83-320-19-131147

数据表

546 Bulk Active PGA 320 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-281-19-001112

614-83-281-19-001112

CONN SOCKET PGA 281POS GOLD

Preci-Dip

0 -
614-83-281-19-001112

数据表

614 Bulk Active PGA 281 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0538-G-T

APH-0538-G-T

APH-0538-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1238-G-T

APH-1238-G-T

APH-1238-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0838-G-T

APH-0838-G-T

APH-0838-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1638-G-T

APH-1638-G-T

APH-1638-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
546-83-321-19-121147

546-83-321-19-121147

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
546-83-321-19-121147

数据表

546 Bulk Active PGA 321 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
558-10-255M16-001104

558-10-255M16-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
558-10-255M16-001104

数据表

558 Bulk Active BGA 255 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-256M16-000104

558-10-256M16-000104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
558-10-256M16-000104

数据表

558 Bulk Active BGA 256 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-256M20-001104

558-10-256M20-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
558-10-256M20-001104

数据表

558 Bulk Active BGA 256 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-255M16-001105

518-77-255M16-001105

CONN SOCKET PGA 255POS GOLD

Preci-Dip

0 -
518-77-255M16-001105

数据表

518 Bulk Active PGA 255 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-272M20-001101

558-10-272M20-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0 -
558-10-272M20-001101

数据表

558 Bulk Active PGA 272 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
550-80-381-18-101135

550-80-381-18-101135

PGA SOLDER TAIL

Preci-Dip

0 -
550-80-381-18-101135

数据表

550 Bulk Active PGA 381 (18 x 18) 0.050" (1.27mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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