IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
42-3553-16

42-3553-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0 -
42-3553-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6551-16

42-6551-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0 -
42-6551-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6552-16

42-6552-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0 -
42-6552-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6553-16

42-6553-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0 -
42-6553-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6554-16

42-6554-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0 -
42-6554-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
558-10-504M29-001101

558-10-504M29-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0 -
558-10-504M29-001101

数据表

558 Bulk Active PGA 504 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
163-PGM15066-10T

163-PGM15066-10T

CONN SOCKET PGA TIN

Aries Electronics

0 -
163-PGM15066-10T

数据表

PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
163-PGM15067-10T

163-PGM15067-10T

CONN SOCKET PGA TIN

Aries Electronics

0 -
163-PGM15067-10T

数据表

PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
64-PRS16016-12

64-PRS16016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
64-PRS16016-12

数据表

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
101-PLS14030-12

101-PLS14030-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
101-PLS14030-12

数据表

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
HLS-0820-G-38

HLS-0820-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0820-G-38

数据表

HLS Bulk Active SIP 160 (8 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
558-10-478M26-131104

558-10-478M26-131104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
558-10-478M26-131104

数据表

558 Bulk Active BGA 478 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Open Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
44-PLS12017-12

44-PLS12017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
44-PLS12017-12

数据表

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
44-PRS12017-12

44-PRS12017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
44-PRS12017-12

数据表

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
100-PLS10001-12

100-PLS10001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
100-PLS10001-12

数据表

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
518-77-478M26-131105

518-77-478M26-131105

CONN SOCKET PGA 478POS GOLD

Preci-Dip

0 -
518-77-478M26-131105

数据表

518 Bulk Active PGA 478 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-480M29-001104

558-10-480M29-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
558-10-480M29-001104

数据表

558 Bulk Active BGA 480 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
144-PRS13095-12

144-PRS13095-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
144-PRS13095-12

数据表

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
514-83-576M30-001148

514-83-576M30-001148

CONN SOCKET BGA 576POS GOLD

Preci-Dip

0 -
514-83-576M30-001148

数据表

514 Bulk Active BGA 576 (30 x 30) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
518-77-480M29-001105

518-77-480M29-001105

CONN SOCKET PGA 480POS GOLD

Preci-Dip

0 -
518-77-480M29-001105

数据表

518 Bulk Active PGA 480 (29 x 29) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
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