IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
200-6313-9UN-1900

200-6313-9UN-1900

CONN SOCKET PGA ZIF 169POS GOLD

3M

0 -
200-6313-9UN-1900

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
200-6315-9UN-1900

200-6315-9UN-1900

CONN SOCKET PGA ZIF 225POS GOLD

3M

0 -
200-6315-9UN-1900

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 225 (15 x 15) 0.100" (2.54mm) - - - - - - 0.100" (2.54mm) - - - Polyethersulfone (PES) -55°C ~ 150°C
200-6317-9UN-1900

200-6317-9UN-1900

CONN SOCKET PGA ZIF 289POS GOLD

3M

0 -
200-6317-9UN-1900

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 289 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
1-390261-8

1-390261-8

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors

0 -
1-390261-8

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
8058-39G4

8058-39G4

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors

0 -

-

8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
1-390261-6

1-390261-6

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

0 -
1-390261-6

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
100-006-000

100-006-000

CONN IC DIP SOCKET 6POS GOLD

3M

0 -
100-006-000

数据表

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-008-000

100-008-000

CONN IC DIP SOCKET 8POS GOLD

3M

0 -
100-008-000

数据表

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-008-001

100-008-001

CONN IC DIP SOCKET 8POS GOLD

3M

0 -
100-008-001

数据表

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-010-000

100-010-000

CONN IC DIP SOCKET 10POS GOLD

3M

0 -
100-010-000

数据表

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-014-000

100-014-000

CONN IC DIP SOCKET 14POS GOLD

3M

0 -
100-014-000

数据表

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-014-001

100-014-001

CONN IC DIP SOCKET 14POS GOLD

3M

0 -
100-014-001

数据表

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-016-000

100-016-000

CONN IC DIP SOCKET 16POS GOLD

3M

0 -
100-016-000

数据表

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-016-001

100-016-001

CONN IC DIP SOCKET 16POS GOLD

3M

0 -
100-016-001

数据表

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-018-000

100-018-000

CONN IC DIP SOCKET 18POS GOLD

3M

0 -

-

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-020-000

100-020-000

CONN IC DIP SOCKET 20POS GOLD

3M

0 -

-

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-020-001

100-020-001

CONN IC DIP SOCKET 20POS GOLD

3M

0 -

-

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-022-000

100-022-000

CONN IC DIP SOCKET 22POS GOLD

3M

0 -

-

100 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-024-000

100-024-000

CONN IC DIP SOCKET 24POS GOLD

3M

0 -

-

100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
100-024-001

100-024-001

CONN IC DIP SOCKET 24POS GOLD

3M

0 -

-

100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
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