IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
2124-6313-9UA-1902

2124-6313-9UA-1902

TEST BURN-IN PGA

3M

0 -
2124-6313-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 124 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2209-6317-9UA-1902

2209-6317-9UA-1902

GRID ZIP

3M

0 -
2209-6317-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 209 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2225-6317-9UA-1902

2225-6317-9UA-1902

TEXTOOL

3M

0 -
2225-6317-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 225 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2120-6313-9UA-1902

2120-6313-9UA-1902

PGA 13 X13

3M

0 -
2120-6313-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 120 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2361-6319-9UA-1902

2361-6319-9UA-1902

GRID ZIP 19 X 19

3M

0 -
2361-6319-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 361 (19 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2144-6315-9UA-1902

2144-6315-9UA-1902

GRID ZIP 15 X 15

3M

0 -
2144-6315-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 144 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
244A-6313-9UA-1902

244A-6313-9UA-1902

TEXTOOL

3M

0 -
244A-6313-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2108-6313-9UA-1902

2108-6313-9UA-1902

GRID ZIP 13 X 13

3M

0 -
2108-6313-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 108 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
284-6311-9UA-1902

284-6311-9UA-1902

GRID ZIP 11 X 11

3M

0 -
284-6311-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 84 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
224A-6313-9UA-1902

224A-6313-9UA-1902

TEXTOOL 13 X 13 PGA

3M

0 -
224A-6313-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2289-6317-9UA-1902

2289-6317-9UA-1902

GRID ZIP 17 X 17

3M

0 -
2289-6317-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 289 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2225-6315-9UA-1902

2225-6315-9UA-1902

GRID ZIP 15X15

3M

0 -
2225-6315-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 225 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
272-6311-9UA-1902

272-6311-9UA-1902

TEST BURN-IN PGA

3M

0 -
272-6311-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 72 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2180-6315-9UA-1902

2180-6315-9UA-1902

GRID ZIP 15 X 15

3M

0 -
2180-6315-9UA-1902

数据表

Textool™ Bulk Discontinued at Digi-Key PGA, ZIF (ZIP) 180 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2169-6317-9UA-1902

2169-6317-9UA-1902

PGA

3M

0 -
2169-6317-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 169 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
272-6325-9UA-1902

272-6325-9UA-1902

TEST BURN-IN PGA

3M

0 -
272-6325-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 72 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2184-6325-9UA-1902

2184-6325-9UA-1902

TEST BURN-IN PGA

3M

0 -
2184-6325-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 184 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2141-6321-9UA-1902

2141-6321-9UA-1902

TEST AND BURN-IN PGA

3M

0 -
2141-6321-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 141 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2192-6325-9UA-1902

2192-6325-9UA-1902

TEST BURN-IN PGA

3M

0 -
2192-6325-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 192 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2280-6319-9UA-1902

2280-6319-9UA-1902

TEXTOOL

3M

0 -
2280-6319-9UA-1902

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 280 (19 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
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