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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 成分 直径 熔点 助焊剂类型 线规 网格类型 工艺 形式 保质期 保质期起始 储存/冷藏温度
WC9601020P

WC9601020P

SAC 305 WATER SOLUBLE FLUX 1 LB.

Canfield Technologies

50 -
WC9601020P

数据表

- Spool Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.020" (0.51mm) 423 ~ 424°F (217 ~ 218°C) Water Soluble 24 AWG, 25 SWG - Lead Free Spool, 1 lb (453.59g) 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
NC191LT10

NC191LT10

SMOOTH FLOW LOW TEMP SOLDER PAST

Chip Quik Inc.

81 -
NC191LT10

数据表

Smooth Flow™ Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 280°F (138°C) No-Clean - 4 Lead Free Syringe, 0.35 oz (10g), 5cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
NC191LTA10

NC191LTA10

SMOOTH FLOW LOW TEMP SOLDER PAST

Chip Quik Inc.

73 -
NC191LTA10

数据表

Smooth Flow™ Bulk Active Solder Paste Bi57Sn42Ag1 (57/42/1) - 279°F (137°C) No-Clean - 4 - Syringe, 0.35 oz (10g), 3cc 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
EXB-SN63PB37-0.5LB

EXB-SN63PB37-0.5LB

SOLDER BAR SN63/PB37 0.5LB (227G

Chip Quik Inc.

99 -
EXB-SN63PB37-0.5LB

数据表

Super Low Dross™ Bulk Active Bar Solder Sn63Pb37 (63/37) - 361°F (183°C) - - - Leaded Bar, 0.5 lb (227g) - - -
SMD291AX

SMD291AX

SOLDER PASTE NO-CLEAN 63/37 5CC

Chip Quik Inc.

61 -
SMD291AX

数据表

- Dispenser Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 3 Leaded Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMDLTLFP

SMDLTLFP

SOLDER PASTE LOW TEMP 5CC W/TIP

Chip Quik Inc.

98 -
SMDLTLFP

数据表

- Dispenser Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 3 Lead Free Syringe, 0.53 oz (15g), 5cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
TS391AX

TS391AX

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

41 -
TS391AX

数据表

- Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
SMD291SNL

SMD291SNL

SOLDER PASTE NO-CLEAN LF 5CC SYR

Chip Quik Inc.

37 -
SMD291SNL

数据表

- Dispenser Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Syringe, 0.53 oz (15g), 5cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
TS391LT

TS391LT

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

87 -
TS391LT

数据表

- Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
SMD291SNL50T3

SMD291SNL50T3

SLDR PASTE NO-CLN SAC305 50G

Chip Quik Inc.

58 -
SMD291SNL50T3

数据表

- Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Jar, 1.76 oz (50g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
TS391SNL

TS391SNL

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

35 -
TS391SNL

数据表

- Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
TS391SNL50

TS391SNL50

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

60 -
TS391SNL50

数据表

- Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Jar, 1.76 oz (50g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
SMDSWLF.031 2OZ

SMDSWLF.031 2OZ

SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.

Chip Quik Inc.

92 -
SMDSWLF.031 2OZ

数据表

- Spool Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031" (0.79mm) 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble 20 AWG, 22 SWG - Lead Free Spool, 2 oz (56.70g) - - -
SMDIN97AG3

SMDIN97AG3

INDIUM SOLDER WIRE (IN97/AG3) 0.

Chip Quik Inc.

69 -
SMDIN97AG3

数据表

SMD Bulk Active Wire Solder In97Ag3 (97/3) 0.031" (0.79mm) 289°F (143°C) - 20 AWG, 21 SWG - Lead Free Spool 24 Months Date of Manufacture -
SMD291AX10

SMD291AX10

SOLDER PASTE NO-CLEAN 63/37 10CC

Chip Quik Inc.

39 -
SMD291AX10

数据表

- Dispenser Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 3 Leaded Syringe, 1.23 oz (35g), 10cc 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
TS391LT50

TS391LT50

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

43 -
TS391LT50

数据表

- Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Jar, 1.76 oz (50g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
SMDLTLFP10

SMDLTLFP10

SOLDER PASTE LOW TEMP 10CC W/TIP

Chip Quik Inc.

33 -
SMDLTLFP10

数据表

- Dispenser Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 3 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMD291AXT5

SMD291AXT5

SOLDER PASTE NO CLEAN 63SN/37PB

Chip Quik Inc.

23 -
SMD291AXT5

数据表

SMD2 Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 5 Leaded Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
T0051403399

T0051403399

WSW SNPB L1, 0,3MM, 100G

Apex Tool Group

66 -
T0051403399

数据表

Weller® Spool Active Wire Solder Sn60Pb40 (60/40) 0.012" (0.31mm) - No-Clean - - Leaded Spool, 3.53 oz (100g) - - -
EXB-SN63PB37

EXB-SN63PB37

SOLDER BAR SN63/PB37 1LB (454G)

Chip Quik Inc.

20 -
EXB-SN63PB37

数据表

Super Low Dross™ Bulk Active Bar Solder Sn63Pb37 (63/37) - 361°F (183°C) - - - Leaded Bar, 1 lb (454g) - - -
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