电源管理 - 专用

电源管理 - 专用

专用电源管理 IC 是面向特定系统,特定负载或特定应用场景设计的电源管理芯片,常用于处理器供电,系统电源控制,负载管理,电源排序,电源保护,电池供电设备,通信模块,汽车电子,工业控制和嵌入式系统等电路中.该类器件可根据应用需求实现稳压控制,电压监控,电流限制,故障保护,低功耗管理和多通道供电管理等功能.

宝利科技作为专业电子元器件分销商,可为客户供应行业主流厂商的多系列专用电源管理 IC 产品,包括德州仪器(Texas Instruments),亚德诺(Analog Devices),意法半导体(STMicroelectronics),安森美(onsemi),英飞凌(Infineon),微芯科技(Microchip),瑞萨(Renesas),恩智浦(NXP),芯源系统(MPS),美信(Maxim Integrated)等品牌.您可在下方产品列表中查询所需专用电源管理芯片型号的库存,价格,封装规格,品牌,参数及 PDF 规格书等相关资料,并提交 BOM 或型号清单进行批量询价.

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装

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图片 厂商型号 可用性 价格 数量 数据表 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MC35FS6510CAER2

MC35FS6510CAER2

FS6500

NXP USA Inc.

0 -
MC35FS6510CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6501CAE

MC33FS6501CAE

SYSTEM BASIS CHIP DCDC 0.8A VCO

NXP USA Inc.

0 -
MC33FS6501CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
71M6403-IGT/F

71M6403-IGT/F

IC ELECTRONIC TRIP UNIT 100-LQFP

Analog Devices Inc./Maxim Integrated

0 -
71M6403-IGT/F

数据表

- 100-LQFP Bulk Discontinued at Digi-Key Electronic Trip Unit - - - - - Surface Mount 100-LQFP (14x14)
MFS2632AMDA0AD

MFS2632AMDA0AD

AUTO SBC

NXP USA Inc.

0 -
MFS2632AMDA0AD

数据表

- 48-LQFP Exposed Pad Tray Active - 30µA 3.2V ~ 40V -40°C ~ 125°C (TA) Automotive - Surface Mount 48-LQFP-EP (7x7)
LM25066IPSQE/NOPB

LM25066IPSQE/NOPB

IC PWR MGMT/PROT PMBUS 24WQFN

Texas Instruments

0 -
LM25066IPSQE/NOPB

数据表

- 24-WFQFN Exposed Pad Tape & Reel (TR) Active Base Station-Networking Line Cards, Servers 5.8mA 2.9V ~ 17V -40°C ~ 85°C - - Surface Mount 24-WQFN (4x5)
MC33FS6517LAER2

MC33FS6517LAER2

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

0 -
MC33FS6517LAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6518NAER2

MC33FS6518NAER2

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

0 -
MC33FS6518NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33816AE

MC33816AE

IC SOLENOID CTRLR PROGRAMMABLE

NXP USA Inc.

0 -

-

- 64-LQFP Exposed Pad Tray Active Solenoid Controller - - -40°C ~ 125°C - - Surface Mount 64-LQFP (10x10)
MC33FS6526NAE

MC33FS6526NAE

SYSTEM BASIS CHIP, DCDC 2.2A VCO

NXP USA Inc.

0 -
MC33FS6526NAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 2.7V ~ 40V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MPF7100BMBA0ESR2

MPF7100BMBA0ESR2

POWER MANAGEMENT IC, I.MX 8, I.M

NXP USA Inc.

0 -
MPF7100BMBA0ESR2

数据表

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active i.MX Processors 10µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC34PF8100CFEPR2

MC34PF8100CFEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100CFEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100CCEPR2

MC34PF8100CCEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100CCEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100A0EPR2

MC34PF8100A0EPR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

0 -
MC34PF8100A0EPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100F3EPR2

MC34PF8100F3EPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100F3EPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100CHEPR2

MC34PF8100CHEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100CHEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100EPEPR2

MC34PF8100EPEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100EPEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100EREPR2

MC34PF8100EREPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100EREPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100EQEPR2

MC34PF8100EQEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100EQEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
BQ501210RGCR

BQ501210RGCR

WIRELESS POWER MEDIUM POWER TRAN

Texas Instruments

0 -
BQ501210RGCR

数据表

- 64-VFQFN Exposed Pad Tape & Reel (TR) Not For New Designs Wireless Power Transmitter 52mA 3V ~ 3.6V -40°C ~ 85°C - - Surface Mount 64-VQFN (9x9)
MC35FS4505CAE

MC35FS4505CAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0 -
MC35FS4505CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
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