电源管理 - 专用

电源管理 - 专用

专用电源管理 IC 是面向特定系统,特定负载或特定应用场景设计的电源管理芯片,常用于处理器供电,系统电源控制,负载管理,电源排序,电源保护,电池供电设备,通信模块,汽车电子,工业控制和嵌入式系统等电路中.该类器件可根据应用需求实现稳压控制,电压监控,电流限制,故障保护,低功耗管理和多通道供电管理等功能.

宝利科技作为专业电子元器件分销商,可为客户供应行业主流厂商的多系列专用电源管理 IC 产品,包括德州仪器(Texas Instruments),亚德诺(Analog Devices),意法半导体(STMicroelectronics),安森美(onsemi),英飞凌(Infineon),微芯科技(Microchip),瑞萨(Renesas),恩智浦(NXP),芯源系统(MPS),美信(Maxim Integrated)等品牌.您可在下方产品列表中查询所需专用电源管理芯片型号的库存,价格,封装规格,品牌,参数及 PDF 规格书等相关资料,并提交 BOM 或型号清单进行批量询价.

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装

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结果
图片 厂商型号 可用性 价格 数量 数据表 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MFS8613BMDA0ESR2

MFS8613BMDA0ESR2

SAFETY SYSTEM BASIS CHIP FOR DOM

NXP USA Inc.

0 -
MFS8613BMDA0ESR2

数据表

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Camera - 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC33FS6511CAE

MC33FS6511CAE

SYSTEM BASIS CHIP DCDC 1.5A VCO

NXP USA Inc.

0 -
MC33FS6511CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC35FS6506CAER2

MC35FS6506CAER2

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0 -
MC35FS6506CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MAX20846BAAFT+T

MAX20846BAAFT+T

COMMON FOOT PRINT 4 X 6 POWER ST

Analog Devices Inc./Maxim Integrated

0 -

-

- - Tape & Reel (TR) Active - - - - - - - -
MAX20846ABAFT+T

MAX20846ABAFT+T

COMMON FOOT PRINT 4 X 6 POWER ST

Analog Devices Inc./Maxim Integrated

0 -

-

- - Tape & Reel (TR) Active - - - - - - - -
MAX20846AAAFT+T

MAX20846AAAFT+T

COMMON FOOT PRINT 4 X 6 POWER ST

Analog Devices Inc./Maxim Integrated

0 -

-

- - Tape & Reel (TR) Active - - - - - - - -
MC35FS4506NAE

MC35FS4506NAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0 -
MC35FS4506NAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
LTC3588IDD-1#TRPBF

LTC3588IDD-1#TRPBF

IC ENERGY HARVESTING PSU 10DFN

Analog Devices Inc.

0 -
LTC3588IDD-1#TRPBF

数据表

- 10-WFDFN Exposed Pad Tape & Reel (TR) Active Energy Harvesting 950nA 2.7V ~ 20V -40°C ~ 125°C - - Surface Mount 10-DFN (3x3)
LTC3588IMSE-1#TRPBF

LTC3588IMSE-1#TRPBF

IC ENERGY HARVESTING PSU 10MSOP

Analog Devices Inc.

0 -
LTC3588IMSE-1#TRPBF

数据表

- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad Tape & Reel (TR) Active Energy Harvesting 950nA 2.7V ~ 20V -40°C ~ 125°C - - Surface Mount 10-MSOP-EP
MC33FS8415GJKSR2

MC33FS8415GJKSR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS8415GJKSR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8415GYKSR2

MC33FS8415GYKSR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS8415GYKSR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8415GYESR2

MC33FS8415GYESR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS8415GYESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8415G0KSR2

MC33FS8415G0KSR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS8415G0KSR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8415G0ESR2

MC33FS8415G0ESR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS8415G0ESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8415GJESR2

MC33FS8415GJESR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS8415GJESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS6507CAE

MC33FS6507CAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0 -
MC33FS6507CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6527LAER2

MC33FS6527LAER2

SYSTEM BASIS CHIP, DCDC 2.2A VCO

NXP USA Inc.

0 -
MC33FS6527LAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6528NAER2

MC33FS6528NAER2

SYSTEM BASIS CHIP, DCDC 2.2A VCO

NXP USA Inc.

0 -
MC33FS6528NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6502NAER2

MC35FS6502NAER2

FS6500

NXP USA Inc.

0 -
MC35FS6502NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33PF8100CGES

MC33PF8100CGES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8100CGES

数据表

- 56-VFQFN Exposed Pad Tray Obsolete High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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