电源管理 - 专用

电源管理 - 专用

专用电源管理 IC 是面向特定系统,特定负载或特定应用场景设计的电源管理芯片,常用于处理器供电,系统电源控制,负载管理,电源排序,电源保护,电池供电设备,通信模块,汽车电子,工业控制和嵌入式系统等电路中.该类器件可根据应用需求实现稳压控制,电压监控,电流限制,故障保护,低功耗管理和多通道供电管理等功能.

宝利科技作为专业电子元器件分销商,可为客户供应行业主流厂商的多系列专用电源管理 IC 产品,包括德州仪器(Texas Instruments),亚德诺(Analog Devices),意法半导体(STMicroelectronics),安森美(onsemi),英飞凌(Infineon),微芯科技(Microchip),瑞萨(Renesas),恩智浦(NXP),芯源系统(MPS),美信(Maxim Integrated)等品牌.您可在下方产品列表中查询所需专用电源管理芯片型号的库存,价格,封装规格,品牌,参数及 PDF 规格书等相关资料,并提交 BOM 或型号清单进行批量询价.

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装

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结果
图片 厂商型号 可用性 价格 数量 数据表 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
RAA2214904GNP#HBB

RAA2214904GNP#HBB

4X6 STD QFN (REVD+G1B; HS_SHORT_

Renesas Electronics Corporation

0 -

-

- - Tape & Reel (TR) Active - - - - - - - -
MAX13362ATL/V+T

MAX13362ATL/V+T

IC SWITCH 24 CHANNEL 40TQFN

Analog Devices Inc./Maxim Integrated

0 -
MAX13362ATL/V+T

数据表

- 40-WFQFN Exposed Pad Tape & Reel (TR) Active Contact Monitor 100nA 3V ~ 5.5V -40°C ~ 125°C Automotive AEC-Q100 Surface Mount 40-TQFN (6x6)
MC33FS6517CAE

MC33FS6517CAE

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

0 -
MC33FS6517CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6518CAER2

MC33FS6518CAER2

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

0 -
MC33FS6518CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS4501CAER2

MC35FS4501CAER2

FS4500

NXP USA Inc.

0 -
MC35FS4501CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MFS8412AMBP8ES

MFS8412AMBP8ES

SAFETY POWER MANAGEMENT IC, QFN4

NXP USA Inc.

0 -
MFS8412AMBP8ES

数据表

- 48-VFQFN Exposed Pad Tray Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MFS8412AMBP7ES

MFS8412AMBP7ES

SAFETY POWER MANAGEMENT IC, QFN4

NXP USA Inc.

0 -
MFS8412AMBP7ES

数据表

- 48-VFQFN Exposed Pad Tray Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
BM92T30MWV-ZE2

BM92T30MWV-ZE2

USB TYPE-C PD CONTROL LSI, RECEI

Rohm Semiconductor

0 -

-

- 40-VFQFN Exposed Pad Tape & Reel (TR) Obsolete USB, Type-C Controller - 4.75V ~ 20V -30°C ~ 105°C - - Surface Mount UQFN040V5050
BM92T50MWV-ZE2

BM92T50MWV-ZE2

USB TYPE-C PD CONTROL LSI, DC IN

Rohm Semiconductor

0 -

-

- 40-VFQFN Exposed Pad Tape & Reel (TR) Obsolete USB, Type-C Controller - 4.75V ~ 20V -30°C ~ 105°C - - Surface Mount UQFN040V5050
MC35FS6508NAER2

MC35FS6508NAER2

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0 -
MC35FS6508NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6507NAE

MC35FS6507NAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0 -
MC35FS6507NAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS8510A2ESR2

MC33FS8510A2ESR2

SYSTEM BASIS CHIP FS8500

NXP USA Inc.

0 -

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33FS8510B6ESR2

MC33FS8510B6ESR2

FS8500

NXP USA Inc.

0 -

-

- - Tape & Reel (TR) Active - - - - - - - -
MC33FS8510D3ESR2

MC33FS8510D3ESR2

FS8510

NXP USA Inc.

0 -

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Power Supplies - 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
AS3650-BCTP

AS3650-BCTP

IC PMU POWER/AUDIO 124-CTBGA

ams-OSRAM USA INC.

0 -

-

- - Tape & Reel (TR) Obsolete - - - - - - - -
MC35FS6501CAER2

MC35FS6501CAER2

FS6500

NXP USA Inc.

0 -
MC35FS6501CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6512LAE

MC33FS6512LAE

SYSTEM BASIS CHIP DCDC 1.5A VCO

NXP USA Inc.

0 -
MC33FS6512LAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC34PF8100A0EP

MC34PF8100A0EP

IC POWER MANAGEMENT

NXP USA Inc.

0 -
MC34PF8100A0EP

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount 56-HVQFN (8x8)
MC34PF8100CHEP

MC34PF8100CHEP

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC34PF8100CHEP

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount 56-HVQFN (8x8)
MC34PF8100CFEP

MC34PF8100CFEP

IC POWER MANAGEMENT I.MX8QXP

NXP USA Inc.

0 -
MC34PF8100CFEP

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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