电源管理 - 专用

电源管理 - 专用

专用电源管理 IC 是面向特定系统,特定负载或特定应用场景设计的电源管理芯片,常用于处理器供电,系统电源控制,负载管理,电源排序,电源保护,电池供电设备,通信模块,汽车电子,工业控制和嵌入式系统等电路中.该类器件可根据应用需求实现稳压控制,电压监控,电流限制,故障保护,低功耗管理和多通道供电管理等功能.

宝利科技作为专业电子元器件分销商,可为客户供应行业主流厂商的多系列专用电源管理 IC 产品,包括德州仪器(Texas Instruments),亚德诺(Analog Devices),意法半导体(STMicroelectronics),安森美(onsemi),英飞凌(Infineon),微芯科技(Microchip),瑞萨(Renesas),恩智浦(NXP),芯源系统(MPS),美信(Maxim Integrated)等品牌.您可在下方产品列表中查询所需专用电源管理芯片型号的库存,价格,封装规格,品牌,参数及 PDF 规格书等相关资料,并提交 BOM 或型号清单进行批量询价.

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装

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图片 厂商型号 可用性 价格 数量 数据表 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MAX16948AGEE/V+

MAX16948AGEE/V+

AUTOMOTIVE DUAL REMOTE ANTENNA C

Analog Devices Inc./Maxim Integrated

0 -

-

- 16-LSSOP (0.154", 3.90mm Width) Exposed Pad Tube Active Systems, Remote Power 2.1mA 4.5V ~ 28V -40°C ~ 105°C Automotive - Surface Mount 16-QSOP-EP
MC33FS8430G1ESR2

MC33FS8430G1ESR2

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

0 -

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33FS8430G2ESR2

MC33FS8430G2ESR2

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

0 -

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33FS8430G0ESR2

MC33FS8430G0ESR2

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

0 -

-

* 56-VFQFN Exposed Pad Tape & Reel (TR) Active - - - - - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8430G4ESR2

MC33FS8430G4ESR2

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

0 -

-

* - Tape & Reel (TR) Active - - - - - - - -
BM92T10MWV-ZE2

BM92T10MWV-ZE2

USB TYPE-C PD CONTROL LSI, RECEI

Rohm Semiconductor

0 -
BM92T10MWV-ZE2

数据表

- 40-VFQFN Exposed Pad Tape & Reel (TR) Obsolete USB, Type-C Controller - 4.75V ~ 20V -30°C ~ 105°C - - Surface Mount UQFN040V5050
MFS8406AMBP4ES

MFS8406AMBP4ES

SAFETY POWER MANAGEMENT IC, QFN4

NXP USA Inc.

0 -
MFS8406AMBP4ES

数据表

- 48-VFQFN Exposed Pad Tray Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC35FS4507NAE

MC35FS4507NAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0 -
MC35FS4507NAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33VR5500V0KSR2

MC33VR5500V0KSR2

1 BUCK, QM, INFOTAINMENT

NXP USA Inc.

0 -
MC33VR5500V0KSR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active SMPS Start-Up 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33VR5500V1KSR2

MC33VR5500V1KSR2

1 BUCK, QM, INFOTAINMENT

NXP USA Inc.

0 -
MC33VR5500V1KSR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active SMPS Start-Up 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MFS8612BMDA0ES

MFS8612BMDA0ES

IC FS86 SYSTEM BASIS CHIP ASIL

NXP USA Inc.

0 -

-

- 48-VFQFN Exposed Pad Tray Active Camera - 4.5V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-QFN (7x7)
MC33FS6503CAER2

MC33FS6503CAER2

SYSTEM BASIS CHIP DCDC 0.8A VCO

NXP USA Inc.

0 -
MC33FS6503CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC33FS6521CAE

MC33FS6521CAE

SYSTEM BASIS CHIP DCDC 2.2A VCO

NXP USA Inc.

0 -
MC33FS6521CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC35FS4508NAER2

MC35FS4508NAER2

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0 -
MC35FS4508NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MVR5510AVMANEPR2

MVR5510AVMANEPR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MVR5510AVMANEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMALEPR2

MVR5510AVMALEPR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MVR5510AVMALEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS6507LAE

MC33FS6507LAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0 -
MC33FS6507LAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33PF8100FJESR2

MC33PF8100FJESR2

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

0 -
MC33PF8100FJESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100F3ESR2

MC33PF8100F3ESR2

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

0 -
MC33PF8100F3ESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
LTC3109EGN#TRPBF

LTC3109EGN#TRPBF

IC BOOST CONVERTER PMU 20SSOP

Analog Devices Inc.

0 -
LTC3109EGN#TRPBF

数据表

- 20-SSOP (0.154", 3.90mm Width) Tape & Reel (TR) Active Energy Harvesting 6mA 30mV ~ 500mV -40°C ~ 125°C - - Surface Mount 20-SSOP
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