排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
ESW-113-34-T-D-LL

ESW-113-34-T-D-LL

CONN SOCKET 26POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-113-34-T-D-LL 数据表 ESW Bulk Active Elevated Socket Forked Board to Board 26 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
SSW-123-02-S-D-019

SSW-123-02-S-D-019

CONN RCPT 46POS 0.1 GOLD PCB

Samtec Inc.

0 -
SSW-123-02-S-D-019 数据表 SSW Bulk Active Receptacle Forked Board to Board or Cable 46 45 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335" (8.51mm) 0.194" (4.93mm) -55°C ~ 125°C UL94 V-0 - - - 4.7A per Contact
SQT-130-01-L-S

SQT-130-01-L-S

CONN RCPT 30POS 0.079 GOLD PCB

Samtec Inc.

0 -
SQT-130-01-L-S 数据表 SQT Bulk Active Receptacle Forked Board to Board or Cable 30 All 0.079" (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.1A per Contact
ESW-107-39-S-D

ESW-107-39-S-D

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-107-39-S-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 14 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-108-44-S-S

ESQ-108-44-S-S

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-108-44-S-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-110-48-G-S

ESW-110-48-G-S

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-110-48-G-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-110-24-G-S

ESW-110-24-G-S

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-110-24-G-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-109-33-L-D

ESQ-109-33-L-D

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-109-33-L-D 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 18 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-113-48-G-S

ESW-113-48-G-S

CONN SOCKET 13POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-113-48-G-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 13 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
TLE-111-01-G-DV

TLE-111-01-G-DV

CONN RCPT 22POS 0.079 GOLD SMD

Samtec Inc.

0 -
TLE-111-01-G-DV 数据表 TLE Bulk Discontinued at Digi-Key Receptacle, Pass Through Female Socket Board to Board or Cable 22 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.177" (4.50mm) - -55°C ~ 125°C - - - - 3.2A per Contact
ESQ-118-12-L-S

ESQ-118-12-L-S

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-118-12-L-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 18 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-105-44-L-D-LL

ESQ-105-44-L-D-LL

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-105-44-L-D-LL 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
CLM-109-02-F-D-P

CLM-109-02-F-D-P

CONN RCPT 18POS 0.039 GOLD SMD

Samtec Inc.

0 -
CLM-109-02-F-D-P 数据表 CLM Tube Active Receptacle Female Socket Board to Board 18 All 0.039" (1.00mm) 2 0.039" (1.00mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 2.8A per Contact
CLM-109-02-FM-D-P

CLM-109-02-FM-D-P

CONN RCPT 18POS 0.039 GOLD SMD

Samtec Inc.

0 -
CLM-109-02-FM-D-P 数据表 CLM Tube Active Receptacle Female Socket Board to Board 18 All 0.039" (1.00mm) 2 0.039" (1.00mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 2.8A per Contact
HLE-109-02-L-DV-A-K

HLE-109-02-L-DV-A-K

CONN RCPT 18POS 0.1 GOLD SMD

Samtec Inc.

0 -
HLE-109-02-L-DV-A-K 数据表 HLE Tube Active Receptacle Female Socket Board to Board 18 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.144" (3.66mm) - -55°C ~ 125°C - - - Board Guide, Pick and Place 4.1A per Contact
ESQ-113-37-G-S-LL

ESQ-113-37-G-S-LL

CONN SOCKET 13POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-113-37-G-S-LL 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 13 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-108-49-S-S

ESQ-108-49-S-S

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-108-49-S-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-108-69-S-S

ESW-108-69-S-S

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-108-69-S-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-108-37-L-D

ESW-108-37-L-D

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-108-37-L-D 数据表 ESW Bulk Active Elevated Socket Forked Board to Board 16 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-108-34-F-D

ESW-108-34-F-D

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-108-34-F-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 16 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户