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制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
CLT-139-02-FM-D-A

CLT-139-02-FM-D-A

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
855-83-144-20-001101

855-83-144-20-001101

CONN SCKT 144P 0.05 GOLD PCB RA

Preci-Dip

0 -
855-83-144-20-001101

数据表

855 Bulk Active Socket Female Socket Board to Board 144 All 0.050" (1.27mm) 3 0.050" (1.27mm) Through Hole, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.174" (4.42mm) 0.126" (3.20mm) -55°C ~ 125°C UL94 V-0 - - - 1A
315-13-132-61-001000

315-13-132-61-001000

CONN RCPT 32POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -

-

315 Tube Active Receptacle Female Socket Board to Board 32 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.108" (2.75mm) -55°C ~ 125°C UL94 V-0 - - - 3A
853-99-078-30-001000

853-99-078-30-001000

CONN RCPT 78P 0.05 TIN-LEAD SMD

Mill-Max Manufacturing Corp.

0 -
853-99-078-30-001000

数据表

853 Bulk Active Receptacle Female Socket Board to Board 78 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Tin-Lead 100.0µin (2.54µm) Black 0.207" (5.25mm) - -55°C ~ 125°C UL94 V-0 - - - 3A
803-99-086-62-001000

803-99-086-62-001000

CONN RCPT 86POS 0.1 TIN-LEAD PCB

Mill-Max Manufacturing Corp.

0 -
803-99-086-62-001000

数据表

803 Bulk Active Receptacle Female Socket Board to Board 86 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Press-Fit, Solder Push-Pull Tin-Lead 100.0µin (2.54µm) Black 0.276" (7.00mm) 0.143" (3.63mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
SQT-140-02-H-D

SQT-140-02-H-D

CONN RCPT 80POS 0.079 GOLD PCB

Samtec Inc.

0 -

-

SQT Bulk Active Receptacle Forked Board to Board or Cable 80 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 50.0µin (1.27µm) Black 0.250" (6.35mm) 0.600" (15.24mm) -55°C ~ 125°C UL94 V-0 - - - 5.1A per Contact
CLH-123-H-D-DV

CLH-123-H-D-DV

CLH-123-H-D-DV

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
803-41-084-61-001000

803-41-084-61-001000

CONN RCPT 84POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -

-

803 Bulk Active Receptacle Female Socket Board to Board 84 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Press-Fit, Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.276" (7.00mm) 0.104" (2.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
399-13-160-10-003000

399-13-160-10-003000

CONN RCPT 60POS 0.1 GOLD PCB R/A

Mill-Max Manufacturing Corp.

0 -
399-13-160-10-003000

数据表

399 Bulk Active Receptacle Female Socket Board to Board 60 All 0.100" (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.100" (2.54mm) 0.126" (3.20mm) -55°C ~ 125°C UL94 V-0 - - - 3A
410-13-232-61-001000

410-13-232-61-001000

CONN RCPT 32POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -

-

410 Bulk Active Receptacle Female Socket Board to Board 32 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.165" (4.20mm) 0.125" (3.18mm) -55°C ~ 125°C UL94 V-0 - - - 3A
CLP-129-02-F-DH-A

CLP-129-02-F-DH-A

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 58 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount, Right Angle Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.135" (3.43mm) - -55°C ~ 125°C UL94 V-0 - - Board Guide 3.3A per Contact
853-43-064-20-001000

853-43-064-20-001000

CONN RCPT 64P 0.05 GOLD PCB R/A

Mill-Max Manufacturing Corp.

0 -
853-43-064-20-001000

数据表

853 Bulk Active Receptacle Female Socket Board to Board 64 All 0.050" (1.27mm) 2 0.050" (1.27mm) Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.120" (3.05mm) 0.135" (3.43mm) -55°C ~ 125°C UL94 V-0 - - - 3A
853-93-064-20-001000

853-93-064-20-001000

CONN RCPT 64P 0.05 GOLD PCB R/A

Mill-Max Manufacturing Corp.

0 -
853-93-064-20-001000

数据表

853 Bulk Active Receptacle Female Socket Board to Board 64 All 0.050" (1.27mm) 2 0.050" (1.27mm) Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.120" (3.05mm) 0.135" (3.43mm) -55°C ~ 125°C UL94 V-0 - - - 3A
855-83-132-10-001101

855-83-132-10-001101

CONN SOCKET 132POS 0.05 GOLD PCB

Preci-Dip

0 -
855-83-132-10-001101

数据表

855 Bulk Active Socket Female Socket Board to Board 132 All 0.050" (1.27mm) 3 0.050" (1.27mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.157" (4.00mm) 0.094" (2.40mm) -55°C ~ 125°C UL94 V-0 - - - 1A
853-41-094-10-011000

853-41-094-10-011000

CONN RCPT 94POS 0.05 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
853-41-094-10-011000

数据表

853 Bulk Active Receptacle Female Socket Board to Board 94 All 0.050" (1.27mm) 2 0.050" (1.27mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.158" (4.01mm) 0.199" (5.05mm) - - - - - -
831-43-043-20-001000

831-43-043-20-001000

CONN RCPT 43P 0.079 GOLD PCB R/A

Mill-Max Manufacturing Corp.

0 -
831-43-043-20-001000

数据表

831 Bulk Active Receptacle Female Socket Board to Board 43 All 0.079" (2.00mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.079" (2.00mm) 0.140" (3.56mm) -55°C ~ 125°C UL94 V-0 - - - 3A
CLP-143-02-L-D-BE-PA

CLP-143-02-L-D-BE-PA

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle, Bottom Entry Female Socket Board to Board 86 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - Board Guide, Pick and Place 3.3A per Contact
803-87-054-10-216101

803-87-054-10-216101

CONN SOCKET 54POS 0.1 GOLD PCB

Preci-Dip

0 -
803-87-054-10-216101

数据表

803 Bulk Active Socket Female Socket Board to Board 54 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 1.476" (37.50mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 - - - 3A
ESQT-150-03-F-Q-330

ESQT-150-03-F-Q-330

CONN SOCKET 200P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Bulk Active Elevated Socket Forked Board to Board or Cable 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.330" (8.38mm) 0.128" (3.25mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-03-F-Q-310

ESQT-150-03-F-Q-310

CONN SOCKET 200P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310" (7.87mm) 0.148" (3.76mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
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