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制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
853-43-092-10-011000

853-43-092-10-011000

CONN RCPT 92POS 0.05 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
853-43-092-10-011000

数据表

853 Bulk Active Receptacle Female Socket Board to Board 92 All 0.050" (1.27mm) 2 0.050" (1.27mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.158" (4.01mm) 0.199" (5.05mm) - - - - - -
833-43-092-10-001000

833-43-092-10-001000

CONN RCPT 92POS 0.079 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
833-43-092-10-001000

数据表

833 Bulk Active Receptacle Female Socket Board to Board 92 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.165" (4.20mm) 0.125" (3.18mm) -55°C ~ 125°C UL94 V-0 - - - 3A
833-93-092-10-001000

833-93-092-10-001000

CONN RCPT 92POS 0.079 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
833-93-092-10-001000

数据表

833 Bulk Active Receptacle Female Socket Board to Board 92 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.165" (4.20mm) 0.125" (3.18mm) -55°C ~ 125°C UL94 V-0 - - - 3A
803-99-092-61-001000

803-99-092-61-001000

CONN RCPT 92POS 0.1 TIN-LEAD PCB

Mill-Max Manufacturing Corp.

0 -

-

803 Bulk Active Receptacle Female Socket Board to Board 92 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Press-Fit, Solder Push-Pull Tin-Lead 100.0µin (2.54µm) Black 0.276" (7.00mm) 0.104" (2.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
851-43-073-10-002000

851-43-073-10-002000

CONN RCPT 73POS 0.05 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
851-43-073-10-002000

数据表

851 Bulk Active Receptacle Female Socket Board to Board 73 All 0.050" (1.27mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.185" (4.70mm) 0.115" (2.92mm) -55°C ~ 125°C UL94 V-0 - - - 3A
851-93-073-10-002000

851-93-073-10-002000

CONN RCPT 73POS 0.05 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
851-93-073-10-002000

数据表

851 Bulk Active Receptacle Female Socket Board to Board 73 All 0.050" (1.27mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.185" (4.70mm) 0.115" (2.92mm) -55°C ~ 125°C UL94 V-0 - - - 3A
805-43-093-10-012000

805-43-093-10-012000

CONN RCPT 93POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
805-43-093-10-012000

数据表

805 Bulk Active Receptacle Female Socket Board to Board 93 All 0.100" (2.54mm) 3 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.165" (4.20mm) 0.125" (3.18mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
SOLC-145-02-L-Q-A-K

SOLC-145-02-L-Q-A-K

CONN RCPT 180POS 0.05 GOLD SMD

Samtec Inc.

0 -

-

FOURRAY™ SOLC Tube Active Receptacle Forked Board to Board 180 All 0.050" (1.27mm) 4 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.160" (4.06mm) - -55°C ~ 125°C UL94 V-0 - - Board Guide, Pick and Place 2.4A per Contact
SOLC-145-02-L-Q-LC-K

SOLC-145-02-L-Q-LC-K

CONN RCPT 180POS 0.05 GOLD SMD

Samtec Inc.

0 -

-

FOURRAY™ SOLC Tube Active Receptacle Forked Board to Board 180 All 0.050" (1.27mm) 4 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.160" (4.06mm) - -55°C ~ 125°C UL94 V-0 - - Board Lock, Pick and Place 2.4A per Contact
CLP-134-02-SM-D-K

CLP-134-02-SM-D-K

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 68 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 3.3A per Contact
CLT-138-02-LM-D-BE-A-K

CLT-138-02-LM-D-BE-A-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLP-144-02-LTL-D

CLP-144-02-LTL-D

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 88 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 3.3A per Contact
CLP-144-02-LM-D-BE

CLP-144-02-LM-D-BE

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle, Bottom Entry Female Socket Board to Board 88 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 3.3A per Contact
329-11-142-41-540000

329-11-142-41-540000

CONN RCPT 42POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
329-11-142-41-540000

数据表

329 Bulk Active Receptacle Female Socket Board to Board 42 All 0.100" (2.54mm) 1 - Through Hole Solder Cup Push-Pull Gold 10.0µin (0.25µm) Black 0.110" (2.79mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 3A
ESQT-150-03-G-D-375

ESQT-150-03-G-D-375

CONN SOCKET 100P 0.079 GOLD PCB

Samtec Inc.

0 -
ESQT-150-03-G-D-375

数据表

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 100 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.375" (9.53mm) 0.083" (2.11mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-03-G-D-310

ESQT-150-03-G-D-310

CONN SOCKET 100P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 100 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310" (7.87mm) 0.148" (3.76mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-03-G-D-312

ESQT-150-03-G-D-312

CONN SOCKET 100P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 100 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.312" (7.92mm) 0.146" (3.70mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-03-G-D-320

ESQT-150-03-G-D-320

CONN SOCKET 100P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 100 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.320" (8.13mm) 0.138" (3.50mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-03-G-D-358

ESQT-150-03-G-D-358

CONN SOCKET 100P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 100 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.358" (9.10mm) 0.100" (2.54mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-03-G-D-360

ESQT-150-03-G-D-360

CONN SOCKET 100P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 100 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.360" (9.14mm) 0.098" (2.50mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
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