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制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
ESQT-130-02-S-Q-368

ESQT-130-02-S-Q-368

CONN SOCKET 120P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 120 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.368" (9.35mm) 0.482" (12.24mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-130-02-S-Q-650

ESQT-130-02-S-Q-650

CONN SOCKET 120P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 120 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.650" (16.50mm) 0.200" (5.08mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-130-02-S-Q-740

ESQT-130-02-S-Q-740

CONN SOCKET 120P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 120 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.740" (18.80mm) 0.110" (2.79mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-130-02-S-Q-750

ESQT-130-02-S-Q-750

CONN SOCKET 120P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 120 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.750" (19.05mm) 0.100" (2.54mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-130-02-S-Q-720

ESQT-130-02-S-Q-720

FLEXYZ FLEXIBLE-HEIGHT SOCKET ST

Samtec Inc.

0 -
ESQT-130-02-S-Q-720

数据表

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 120 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.720" (18.30mm) 0.130" (3.30mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
326-41-162-41-003000

326-41-162-41-003000

CONN RCPT 62POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
326-41-162-41-003000

数据表

326 Bulk Active Receptacle Female Socket Board to Board 62 All 0.100" (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Gold 10.0µin (0.25µm) Black 0.110" (2.79mm) 0.594" (15.09mm) -55°C ~ 125°C - - - - 3A
326-91-162-41-003000

326-91-162-41-003000

CONN RCPT 62POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
326-91-162-41-003000

数据表

326 Bulk Active Receptacle Female Socket Board to Board 62 All 0.100" (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Gold 10.0µin (0.25µm) Black 0.110" (2.79mm) 0.594" (15.09mm) -55°C ~ 125°C - - - - 3A
SQW-133-01-L-6

SQW-133-01-L-6

CONN RCPT 198POS 0.079 GOLD PCB

Samtec Inc.

0 -

-

SQW Tube Active Receptacle Forked Board to Board or Cable 198 All 0.079" (2.00mm) 6 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 3.8A per Contact
SQW-133-01-LM-6

SQW-133-01-LM-6

CONN RCPT 198POS 0.079 GOLD PCB

Samtec Inc.

0 -

-

SQW Tube Active Receptacle Forked Board to Board or Cable 198 All 0.079" (2.00mm) 6 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 3.8A per Contact
YTE-124-02-L-Q-692

YTE-124-02-L-Q-692

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-124-02-L-Q-692

数据表

YTE Tube Active Elevated Socket Forked Board to Board 96 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.692" (17.58mm) - -55°C ~ 105°C - - - - -
YTE-130-02-F-Q-340

YTE-130-02-F-Q-340

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-130-02-F-Q-340

数据表

YTE Tube Active Elevated Socket Forked Board to Board 120 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.340" (8.64mm) - -55°C ~ 105°C - - - - -
YTE-130-02-F-Q-630

YTE-130-02-F-Q-630

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-130-02-F-Q-630

数据表

YTE Tube Active Elevated Socket Forked Board to Board 120 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.630" (16.00mm) - -55°C ~ 105°C - - - - -
YTE-124-02-L-Q-420

YTE-124-02-L-Q-420

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-124-02-L-Q-420

数据表

YTE Tube Active Elevated Socket Forked Board to Board 96 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.420" (10.67mm) - -55°C ~ 105°C - - - - -
YTE-116-02-L-6-472

YTE-116-02-L-6-472

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-116-02-L-6-472

数据表

YTE Tube Active Elevated Socket Forked Board to Board 96 All 0.079" (2.00mm) 6 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.472" (12.00mm) - -55°C ~ 105°C - - - - -
YTE-124-02-L-Q-755

YTE-124-02-L-Q-755

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-124-02-L-Q-755

数据表

YTE Tube Active Elevated Socket Forked Board to Board 96 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.755" (19.18mm) - -55°C ~ 105°C - - - - -
CLT-122-02-SM-D-A

CLT-122-02-SM-D-A

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-120-02-SM-D-BE-A

CLT-120-02-SM-D-BE-A

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
801-13-035-10-007000

801-13-035-10-007000

CONN RCPT 35POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
801-13-035-10-007000

数据表

801 Bulk Active Receptacle Female Socket Board to Board 35 All 0.100" (2.54mm) 1 - Through Hole Solder Cup Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.340" (8.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
803-99-096-10-004000

803-99-096-10-004000

CONN RCPT 96POS 0.1 TIN-LEAD PCB

Mill-Max Manufacturing Corp.

0 -
803-99-096-10-004000

数据表

803 Bulk Active Receptacle Female Socket Board to Board 96 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin-Lead 100.0µin (2.54µm) Black 0.272" (6.91mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
SD-134-G-1A

SD-134-G-1A

.100" DOUBLE ROW SCREW MACHINE S

Samtec Inc.

0 -
SD-134-G-1A

数据表

SD Tube Active Receptacle Female Socket Board to Board 68 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black - 0.360" (9.14mm) -55°C ~ 125°C - - - - -
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