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制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
ESQT-140-02-S-T-465

ESQT-140-02-S-T-465

CONN SOCKET 120P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 120 All 0.079" (2.00mm) 3 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.465" (11.80mm) 0.385" (9.78mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-140-02-S-T-500

ESQT-140-02-S-T-500

CONN SOCKET 120P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 120 All 0.079" (2.00mm) 3 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.500" (12.70mm) 0.350" (8.89mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-140-02-S-T-592

ESQT-140-02-S-T-592

CONN SOCKET 120P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 120 All 0.079" (2.00mm) 3 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.592" (15.04mm) 0.258" (6.55mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
329-43-153-41-540000

329-43-153-41-540000

CONN RCPT 53POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
329-43-153-41-540000

数据表

329 Bulk Active Receptacle Female Socket Board to Board 53 All 0.100" (2.54mm) 1 - Through Hole Solder Cup Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 3A
BCS-128-SM-D-HE

BCS-128-SM-D-HE

PASS-THROUGH SOCKET STRIP, 0.100

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-131-02-SM-D-K

CLT-131-02-SM-D-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
ESQT-144-03-L-Q-309

ESQT-144-03-L-Q-309

CONN SOCKET 176P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Bulk Active Elevated Socket Forked Board to Board or Cable 176 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.309" (7.85mm) 0.149" (3.78mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
FOLC-115-01-L-Q

FOLC-115-01-L-Q

CONN RCPT 60POS 0.05 GOLD PCB

Samtec Inc.

0 -

-

FOURRAY™ FOLC Tube Active Receptacle Female Socket Board to Board 60 All 0.050" (1.27mm) 4 0.050" (1.27mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.180" (4.57mm) 0.075" (1.91mm) -55°C ~ 125°C UL94 V-0 - - - 2.6A per Contact
1444700000

1444700000

CONN RCPT 18POS 0.197 TIN PCB

Weidmüller

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-

Omnimate RSV Bulk Active Receptacle Female Socket Board to Board or Cable 18 All 0.197" (5.00mm) 3 0.197" (5.00mm) Through Hole Solder Latch Holder Tin - Gray 0.563" (14.30mm) 0.126" (3.20mm) -20°C ~ 120°C UL94 V-0 - - Mounting Flange -
1444300000

1444300000

CONN RCPT 18POS 0.197 TIN PCB

Weidmüller

0 -

-

Omnimate RSV Bulk Active Receptacle Female Socket Board to Board or Cable 18 All 0.197" (5.00mm) 3 0.197" (5.00mm) Through Hole Solder Latch Holder Tin - Gray 0.563" (14.30mm) 0.126" (3.20mm) -20°C ~ 120°C UL94 V-0 - - - -
833-13-068-10-002000

833-13-068-10-002000

CONN RCPT 68POS 0.079 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
833-13-068-10-002000

数据表

833 Bulk Active Receptacle Female Socket Board to Board 68 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.179" (4.55mm) 0.111" (2.82mm) -55°C ~ 125°C UL94 V-0 - - - 3A
324-13-146-41-002000

324-13-146-41-002000

CONN RCPT 46POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
324-13-146-41-002000

数据表

324 Bulk Active Receptacle Female Socket Board to Board 46 All 0.100" (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.630" (16.00mm) -55°C ~ 125°C - - - - 3A
SQT-138-02-L-Q

SQT-138-02-L-Q

CONN RCPT 152POS 0.079 GOLD PCB

Samtec Inc.

0 -

-

SQT Tube Active Receptacle Forked Board to Board or Cable 152 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.600" (15.24mm) -55°C ~ 125°C UL94 V-0 - - - 5.1A per Contact
CLM-136-02-G-D-A-K

CLM-136-02-G-D-A-K

LOW PROFILE DUAL-WIPE SOCKET, 1.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
833-41-082-30-001000

833-41-082-30-001000

CONN RCPT 82POS 0.079 GOLD SMD

Mill-Max Manufacturing Corp.

0 -
833-41-082-30-001000

数据表

833 Bulk Active Receptacle Female Socket Board to Board 82 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.228" (5.80mm) - -55°C ~ 125°C UL94 V-0 - - - 3A
833-91-082-30-001000

833-91-082-30-001000

CONN RCPT 82POS 0.079 GOLD SMD

Mill-Max Manufacturing Corp.

0 -
833-91-082-30-001000

数据表

833 Bulk Active Receptacle Female Socket Board to Board 82 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.228" (5.80mm) - -55°C ~ 125°C UL94 V-0 - - - 3A
CLE-177-01-G-DV-A

CLE-177-01-G-DV-A

CONN RCPT 154POS 0.031 GOLD SMD

Samtec Inc.

0 -
CLE-177-01-G-DV-A

数据表

CLE Tube Active Receptacle, Pass Through Female Socket Board to Board 154 All 0.031" (0.80mm) 2 0.047" (1.20mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.130" (3.30mm) - -55°C ~ 125°C UL94 V-0 - - Board Guide 2.7A per Contact
853-43-088-30-001000

853-43-088-30-001000

CONN RCPT 88POS 0.05 GOLD SMD

Mill-Max Manufacturing Corp.

0 -
853-43-088-30-001000

数据表

853 Bulk Active Receptacle Female Socket Board to Board 88 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.207" (5.25mm) - -55°C ~ 125°C UL94 V-0 - - - 3A
853-93-088-30-001000

853-93-088-30-001000

CONN RCPT 88POS 0.05 GOLD SMD

Mill-Max Manufacturing Corp.

0 -
853-93-088-30-001000

数据表

853 Bulk Active Receptacle Female Socket Board to Board 88 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.207" (5.25mm) - -55°C ~ 125°C UL94 V-0 - - - 3A
YTE-112-02-G-Q-755

YTE-112-02-G-Q-755

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-112-02-G-Q-755

数据表

YTE Bulk Active Elevated Socket Forked Board to Board 48 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.755" (19.18mm) - -55°C ~ 105°C - - - - -
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