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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-83-210-01-839101

110-83-210-01-839101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-83-210-01-839101

数据表

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5), 8 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-83-308-41-001101

122-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
122-83-308-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-320-41-001101

115-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
115-87-320-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR40-HZL/01-TT

AR40-HZL/01-TT

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

0 -
AR40-HZL/01-TT

数据表

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
116-87-310-41-007101

116-87-310-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-310-41-007101

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SMPX-20LCC-N

SMPX-20LCC-N

SMT PLCC SOCKET 20P NON POLARISE

Kycon, Inc.

0 -
SMPX-20LCC-N

数据表

SMPX Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
110-83-210-41-105101

110-83-210-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-83-210-41-105101

数据表

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-610-41-001101

612-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
612-83-610-41-001101

数据表

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-210-41-006101

116-83-210-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-210-41-006101

数据表

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-310-41-006101

116-83-310-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-310-41-006101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR24-HZL/01-TT

AR24-HZL/01-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

0 -
AR24-HZL/01-TT

数据表

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
10-0518-10T

10-0518-10T

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0 -
10-0518-10T

数据表

518 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
10-1518-10T

10-1518-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-1518-10T

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
2-382467-1

2-382467-1

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

0 -
2-382467-1

数据表

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X20-001B

SIP1X20-001B

SIP1X20-001B-SIP SOCKET 20 CTS

Amphenol ICC (FCI)

0 -
SIP1X20-001B

数据表

SIP1x Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
540-88-068-17-400

540-88-068-17-400

CONN SOCKET PLCC 68POS TIN

Preci-Dip

0 -
540-88-068-17-400

数据表

540 Bulk Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
115-87-420-41-001101

115-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
115-87-420-41-001101

数据表

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-314-10-002101

110-83-314-10-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
110-83-314-10-002101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 8 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 28 HGL-TT

AR 28 HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 28 HGL-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 28 HGL/7-TT

AR 28 HGL/7-TT

SOCKET

Assmann WSW Components

0 -
AR 28 HGL/7-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
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