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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-83-314-41-005101

110-83-314-41-005101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
110-83-314-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-314-41-605101

110-83-314-41-605101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
110-83-314-41-605101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-316-41-001101

614-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
614-87-316-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-314-41-018101

116-87-314-41-018101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
116-87-314-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-308-41-007101

116-83-308-41-007101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-83-308-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-316-01-931101

110-83-316-01-931101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
110-83-316-01-931101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0104-T-2

HLS-0104-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0104-T-2

数据表

HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
110-87-428-41-001101

110-87-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-87-428-41-001101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-210-41-018101

116-87-210-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-210-41-018101

数据表

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-310-41-134191

114-83-310-41-134191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
114-83-310-41-134191

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-310-41-018101

116-83-310-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-310-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
07-0513-10T

07-0513-10T

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0513-10T

数据表

0513 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
0784990002

0784990002

CONN CAM SOCKET 24POS GOLD

Molex

0 -
0784990002

数据表

78499 Tape & Reel (TR) Obsolete Camera Socket 24 (2 x 4, 2 x 8) 0.024" (0.60mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Closed Frame Solder 0.024" (0.60mm) Gold Flash Copper Alloy Plastic -55°C ~ 85°C
08-3513-10

08-3513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-3513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
SIP050-1X13-160B

SIP050-1X13-160B

1X13-160B-SIP SOCKET 13 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X13-160B

数据表

SIP050-1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
110-87-424-41-005101

110-87-424-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-87-424-41-005101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-99-032-17-400200

540-99-032-17-400200

CONN SOCKET PLCC 32POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-032-17-400200

数据表

540 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
540-99-028-24-000000

540-99-028-24-000000

CONN SOCKET PLCC 28POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-028-24-000000

数据表

540 Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
AR 50-HGL-TT

AR 50-HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 50-HGL-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
ED032PLCZ

ED032PLCZ

CONN SOCKET PLCC 32POS TIN

On Shore Technology Inc.

0 -
ED032PLCZ

数据表

ED Tube Active PLCC 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
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