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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
10-0518-11

10-0518-11

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0 -
10-0518-11

数据表

518 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
10-1518-11

10-1518-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-1518-11

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-0517-90C

04-0517-90C

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0517-90C

数据表

0517 Bulk Active SIP 4 (1 x 4) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-87-308-41-004101

116-87-308-41-004101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-87-308-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-324-41-134161

114-87-324-41-134161

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
114-87-324-41-134161

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-628-41-005101

110-87-628-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-87-628-41-005101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1571552-6

1571552-6

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

0 -
1571552-6

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
299-87-306-11-001101

299-87-306-11-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
299-87-306-11-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
808-AG10D-ES

808-AG10D-ES

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
808-AG10D-ES

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
06-3518-10M

06-3518-10M

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-3518-10M

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
146-87-312-41-035101

146-87-312-41-035101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
146-87-312-41-035101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-312-41-036101

146-87-312-41-036101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
146-87-312-41-036101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP640-011B

DIP640-011B

DIP640-011B-DIP SOCKET 40 CTS

Amphenol ICC (FCI)

0 -
DIP640-011B

数据表

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
AR 18-HZL/07-TT

AR 18-HZL/07-TT

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

0 -
AR 18-HZL/07-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
7-1437539-7

7-1437539-7

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
7-1437539-7

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
410-87-224-10-002101

410-87-224-10-002101

CONN ZIG-ZAG 24POS GOLD

Preci-Dip

0 -
410-87-224-10-002101

数据表

410 Bulk Active Zig-Zag, Right Stackable 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
7-1437535-0

7-1437535-0

CONN SOCKET SIP 14POS GOLD

TE Connectivity AMP Connectors

0 -
7-1437535-0

数据表

- Bulk Obsolete SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 10.0µin (0.25µm) Beryllium Copper Polyester -55°C ~ 125°C
116-87-610-41-001101

116-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-610-41-001101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1571550-2

1571550-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

0 -
1571550-2

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
510-87-032-09-041101

510-87-032-09-041101

CONN SOCKET PGA 32POS GOLD

Preci-Dip

0 -
510-87-032-09-041101

数据表

510 Bulk Active PGA 32 (9 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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