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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
12-0518-10H

12-0518-10H

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0518-10H

数据表

518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
12-1518-10H

12-1518-10H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-1518-10H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
13-0518-10T

13-0518-10T

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
13-0518-10T

数据表

518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
A32-LCG-T-R

A32-LCG-T-R

CONN IC DIP SOCKET 32POS GOLD

Assmann WSW Components

0 -
A32-LCG-T-R

数据表

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
ED052PLCZ

ED052PLCZ

CONN SOCKET PLCC 52POS TIN

On Shore Technology Inc.

0 -
ED052PLCZ

数据表

ED Tube Active PLCC 52 (2 x 26) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
SIP050-1X15-160B

SIP050-1X15-160B

1X15-160B-SIP SOCKET 15 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X15-160B

数据表

SIP050-1x Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
540-88-020-17-400

540-88-020-17-400

CONN SOCKET PLCC 20POS TIN

Preci-Dip

0 -
540-88-020-17-400

数据表

540 Bulk Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
114-83-316-41-117101

114-83-316-41-117101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
114-83-316-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-316-41-134161

114-83-316-41-134161

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
114-83-316-41-134161

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-316-41-003101

116-87-316-41-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
116-87-316-41-003101

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-312-41-018101

116-83-312-41-018101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
116-83-312-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ED028PLCZ

ED028PLCZ

CONN SOCKET PLCC 28POS TIN

On Shore Technology Inc.

0 -
ED028PLCZ

数据表

ED Tube Active PLCC 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
AW 127-32/Z-T

AW 127-32/Z-T

SOCKET 32 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-32/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
506-AG11D

506-AG11D

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

0 -
506-AG11D

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
299-87-306-10-001101

299-87-306-10-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
299-87-306-10-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-318-41-105161

110-87-318-41-105161

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-87-318-41-105161

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-87-312-41-001101

122-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
122-87-312-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ED084PLCZ-SM-N

ED084PLCZ-SM-N

CONN SOCKET PLCC 84POS

On Shore Technology Inc.

0 -
ED084PLCZ-SM-N

数据表

ED Tube Active PLCC 84 (2x42) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
116-87-318-41-006101

116-87-318-41-006101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-87-318-41-006101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-320-41-134191

114-87-320-41-134191

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
114-87-320-41-134191

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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