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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
540-99-084-17-400000

540-99-084-17-400000

CONN SOCKET PLCC 84POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-084-17-400000

数据表

540 Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
HLS-0303-TT-11

HLS-0303-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0303-TT-11

数据表

HLS Tube Active SIP 9 (3 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
110-83-328-01-762101

110-83-328-01-762101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-328-01-762101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14), 16 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-87-620-41-105101

117-87-620-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
117-87-620-41-105101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-322-31-012101

614-87-322-31-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
614-87-322-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-318-41-001101

614-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
614-83-318-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
10-0513-10H

10-0513-10H

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0 -
10-0513-10H

数据表

0513 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-0503-20

04-0503-20

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0503-20

数据表

0503 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
04-0503-30

04-0503-30

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0503-30

数据表

0503 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
20-0518-10

20-0518-10

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-0518-10

数据表

518 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-044-08-031101

510-87-044-08-031101

CONN SOCKET PGA 44POS GOLD

Preci-Dip

0 -
510-87-044-08-031101

数据表

510 Bulk Active PGA 44 (8 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-316-41-035101

146-87-316-41-035101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
146-87-316-41-035101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-316-41-036101

146-87-316-41-036101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
146-87-316-41-036101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
917-87-210-41-005101

917-87-210-41-005101

CONN TRANSIST TO-5 10POS GOLD

Preci-Dip

0 -
917-87-210-41-005101

数据表

917 Bulk Active Transistor, TO-5 10 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
917-83-208-41-005101

917-83-208-41-005101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

0 -
917-83-208-41-005101

数据表

917 Bulk Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X24-157B

SIP050-1X24-157B

1X24-157B-SIP SOCKET 24 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X24-157B

数据表

SIP050-1x Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
114-83-320-41-134161

114-83-320-41-134161

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
114-83-320-41-134161

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-314-41-012101

116-83-314-41-012101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
116-83-314-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR20-HZL/01-TT-R

AR20-HZL/01-TT-R

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

0 -
AR20-HZL/01-TT-R

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
4-1437539-6

4-1437539-6

CONN IC DIP SOCKET 18POS TINLEAD

TE Connectivity AMP Connectors

0 -
4-1437539-6

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
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