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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
ICF-308-TM-I

ICF-308-TM-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-308-TM-I

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
09-0513-11

09-0513-11

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0513-11

数据表

0513 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
14-0518-11

14-0518-11

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
14-0518-11

数据表

518 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
SIP050-1X21-160B

SIP050-1X21-160B

1X21-160B-SIP SOCKET 21 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X21-160B

数据表

SIP050-1x Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
HLS-0203-T-2

HLS-0203-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0203-T-2

数据表

HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
116-87-420-41-018101

116-87-420-41-018101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-87-420-41-018101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
121-83-314-41-001101

121-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
121-83-314-41-001101

数据表

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-610-41-011101

116-83-610-41-011101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-610-41-011101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
19-0518-10T

19-0518-10T

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0 -
19-0518-10T

数据表

518 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
21-0518-10

21-0518-10

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0518-10

数据表

518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
SIP050-1X22-160B

SIP050-1X22-160B

1X22-160B-SIP SOCKET 22 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X22-160B

数据表

SIP050-1x Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
9-1437535-1

9-1437535-1

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
9-1437535-1

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy - -55°C ~ 125°C
HLS-0202-G-10

HLS-0202-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0202-G-10

数据表

HLS Tube Active SIP 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
110-83-324-41-005101

110-83-324-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-83-324-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-324-41-605101

110-83-324-41-605101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-83-324-41-605101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-424-41-005101

110-83-424-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-83-424-41-005101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X26-157B

SIP050-1X26-157B

1X26-157B-SIP SOCKET 26 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X26-157B

数据表

SIP050-1x Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
115-83-422-41-003101

115-83-422-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
115-83-422-41-003101

数据表

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-632-41-117101

114-87-632-41-117101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
114-87-632-41-117101

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-632-41-134161

114-87-632-41-134161

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
114-87-632-41-134161

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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