IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
16-0518-11

16-0518-11

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0518-11

数据表

518 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
16-1518-11

16-1518-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-1518-11

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICO-308-CTT

ICO-308-CTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-308-CTT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
540-88-044-24-008

540-88-044-24-008

CONN SOCKET PLCC 44POS TIN

Preci-Dip

0 -
540-88-044-24-008

数据表

540 Bulk Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
APH-0902-T-H

APH-0902-T-H

APH-0902-T-H

Samtec Inc.

0 -
APH-0902-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1502-T-H

APH-1502-T-H

APH-1502-T-H

Samtec Inc.

0 -
APH-1502-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1902-T-H

APH-1902-T-H

APH-1902-T-H

Samtec Inc.

0 -
APH-1902-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1102-T-H

APH-1102-T-H

APH-1102-T-H

Samtec Inc.

0 -
APH-1102-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1602-T-H

APH-1602-T-H

APH-1602-T-H

Samtec Inc.

0 -
APH-1602-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0702-T-H

APH-0702-T-H

APH-0702-T-H

Samtec Inc.

0 -
APH-0702-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0302-T-H

APH-0302-T-H

APH-0302-T-H

Samtec Inc.

0 -
APH-0302-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0402-T-H

APH-0402-T-H

APH-0402-T-H

Samtec Inc.

0 -
APH-0402-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0802-T-H

APH-0802-T-H

APH-0802-T-H

Samtec Inc.

0 -
APH-0802-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1702-T-H

APH-1702-T-H

APH-1702-T-H

Samtec Inc.

0 -
APH-1702-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1802-T-H

APH-1802-T-H

APH-1802-T-H

Samtec Inc.

0 -
APH-1802-T-H

数据表

* - Active - - - - - - - - - - - - - - -
116-83-318-41-003101

116-83-318-41-003101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-83-318-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-83-316-41-001101

122-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
122-83-316-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1-1825094-7

1-1825094-7

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
1-1825094-7

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
1-1825109-1

1-1825109-1

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
1-1825109-1

数据表

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
116-87-624-41-003101

116-87-624-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-624-41-003101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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