IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
3-822516-1

3-822516-1

CONN SOCKET PLCC 44POS TIN

TE Connectivity AMP Connectors

0 -
3-822516-1

数据表

- Tape & Reel (TR) Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
APH-0902-T-R

APH-0902-T-R

APH-0902-T-R

Samtec Inc.

0 -
APH-0902-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1902-T-R

APH-1902-T-R

APH-1902-T-R

Samtec Inc.

0 -
APH-1902-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1602-T-R

APH-1602-T-R

APH-1602-T-R

Samtec Inc.

0 -
APH-1602-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0202-T-R

APH-0202-T-R

APH-0202-T-R

Samtec Inc.

0 -
APH-0202-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0702-T-R

APH-0702-T-R

APH-0702-T-R

Samtec Inc.

0 -
APH-0702-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0402-T-R

APH-0402-T-R

APH-0402-T-R

Samtec Inc.

0 -
APH-0402-T-R

数据表

* - Active - - - - - - - - - - - - - - -
2-382470-4

2-382470-4

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

0 -
2-382470-4

数据表

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR48-HZL/01-TT

AR48-HZL/01-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components

0 -
AR48-HZL/01-TT

数据表

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
917-83-210-41-053101

917-83-210-41-053101

CONN TRANSIST TO-5 10POS GOLD

Preci-Dip

0 -
917-83-210-41-053101

数据表

917 Bulk Active Transistor, TO-5 10 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
20-3513-10T

20-3513-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
117-87-624-41-105101

117-87-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
117-87-624-41-105101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-88-068-24-008

540-88-068-24-008

CONN SOCKET PLCC 68POS TIN

Preci-Dip

0 -
540-88-068-24-008

数据表

540 Bulk Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
08-2513-10H

08-2513-10H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-2513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
115-87-636-41-003101

115-87-636-41-003101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
115-87-636-41-003101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-87-640-41-005101

117-87-640-41-005101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
117-87-640-41-005101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-324-41-117101

114-83-324-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
114-83-324-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-324-41-134161

114-83-324-41-134161

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
114-83-324-41-134161

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X27-157B

SIP050-1X27-157B

1X27-157B-SIP SOCKET 27 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X27-157B

数据表

SIP050-1x Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SA649000

SA649000

CONN IC DIP SOCKET 64POS GOLD

On Shore Technology Inc.

0 -
SA649000

数据表

SA Tube Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
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