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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
917-83-210-41-005101

917-83-210-41-005101

CONN TRANSIST TO-5 10POS GOLD

Preci-Dip

0 -
917-83-210-41-005101

数据表

917 Bulk Active Transistor, TO-5 10 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AW-127A-20-Z

AW-127A-20-Z

CONN SOCKET SIP 20POS TIN

Assmann WSW Components

0 -
AW-127A-20-Z

数据表

- - Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Tin 78.7µin (2.00µm) - Through Hole Closed Frame - - - - - - -
110-83-318-41-105191

110-83-318-41-105191

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-83-318-41-105191

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
832-AG11D-ESL

832-AG11D-ESL

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

0 -
832-AG11D-ESL

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
DIP648-001B

DIP648-001B

DIP648-001B-DIP SOCKET 48 CTS

Amphenol ICC (FCI)

0 -
DIP648-001B

数据表

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
510-83-036-06-000101

510-83-036-06-000101

CONN SOCKET PGA 36POS GOLD

Preci-Dip

0 -
510-83-036-06-000101

数据表

510 Bulk Active PGA 36 (6 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-320-41-018101

116-83-320-41-018101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-83-320-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
214-99-308-01-670799

214-99-308-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -
214-99-308-01-670799

数据表

214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
ICA-316-ZSTT

ICA-316-ZSTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-316-ZSTT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICO-316-ZSTT

ICO-316-ZSTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-316-ZSTT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
116-87-420-41-012101

116-87-420-41-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-87-420-41-012101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-318-STT

ICO-318-STT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-318-STT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
12-4513-10

12-4513-10

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-4513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
07-0513-11H

07-0513-11H

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0513-11H

数据表

0513 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
123-87-322-41-001101

123-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
123-87-322-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-87-210-10-001101

299-87-210-10-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
299-87-210-10-001101

数据表

299 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X26-160B

SIP050-1X26-160B

1X26-160B-SIP SOCKET 26 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X26-160B

数据表

SIP050-1x Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
116-87-428-41-006101

116-87-428-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-87-428-41-006101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-308-WTT-2

ICA-308-WTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-308-WTT-2

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
110-83-322-41-105101

110-83-322-41-105101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
110-83-322-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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