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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
C8120-04

C8120-04

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

0 -
C8120-04

数据表

Edge-Grip™, C81 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
612-83-428-41-001101

612-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
612-83-428-41-001101

数据表

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-628-41-105161

110-83-628-41-105161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-628-41-105161

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-642-41-105101

110-87-642-41-105101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
110-87-642-41-105101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-87-656-41-005101

117-87-656-41-005101

CONN IC DIP SOCKET 56POS GOLD

Preci-Dip

0 -
117-87-656-41-005101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
518-AG11D-ES

518-AG11D-ES

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

0 -
518-AG11D-ES

数据表

500 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 25.0µin (0.63µm) Beryllium Copper Polyester -55°C ~ 125°C
07-0503-20

07-0503-20

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0503-20

数据表

0503 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
07-0503-30

07-0503-30

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0503-30

数据表

0503 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
14-0518-11H

14-0518-11H

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
14-0518-11H

数据表

518 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
14-1518-11H

14-1518-11H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
35-0518-10

35-0518-10

CONN SOCKET SIP 35POS GOLD

Aries Electronics

0 -
35-0518-10

数据表

518 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
121-83-420-41-001101

121-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
121-83-420-41-001101

数据表

121 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-318-41-004101

116-87-318-41-004101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-87-318-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-628-41-006101

116-83-628-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-83-628-41-006101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-87-640-41-001101

612-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
612-87-640-41-001101

数据表

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-322-41-007101

116-83-322-41-007101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-83-322-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-084-10-001101

510-87-084-10-001101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

0 -
510-87-084-10-001101

数据表

510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-084-10-031101

510-87-084-10-031101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

0 -
510-87-084-10-031101

数据表

510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0112-S-2

HLS-0112-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0112-S-2

数据表

HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
146-83-320-41-036101

146-83-320-41-036101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
146-83-320-41-036101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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