IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
HLS-0204-G-2

HLS-0204-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0204-G-2

数据表

HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICA-308-ZSGT-L

ICA-308-ZSGT-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-308-ZSGT-L

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
26-1518-10

26-1518-10

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-1518-10

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
114-83-636-41-117101

114-83-636-41-117101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
114-83-636-41-117101

数据表

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-328-41-002101

116-87-328-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-87-328-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1-1571552-2

1-1571552-2

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors

0 -
1-1571552-2

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
13-0513-11H

13-0513-11H

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
13-0513-11H

数据表

0513 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-83-420-41-009101

116-83-420-41-009101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-83-420-41-009101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-314-ZSST

ICA-314-ZSST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-314-ZSST

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-314-ZSST

ICO-314-ZSST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-314-ZSST

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
115-87-950-41-001101

115-87-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
115-87-950-41-001101

数据表

115 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-610-41-013101

116-83-610-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-610-41-013101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APA-316-T-J

APA-316-T-J

ADAPTER PLUG

Samtec Inc.

0 -
APA-316-T-J

数据表

APA Tube Active - 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
6-1437529-6

6-1437529-6

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

0 -
6-1437529-6

数据表

500 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 47.2µin (1.20µm) Copper Alloy Thermoplastic, Polyester -55°C ~ 105°C
510-87-085-11-045101

510-87-085-11-045101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

0 -
510-87-085-11-045101

数据表

510 Bulk Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-44-084-17-400000

540-44-084-17-400000

CONN SOCKET PLCC 84POS TIN

Mill-Max Manufacturing Corp.

1 -
540-44-084-17-400000

数据表

540 Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
116-83-328-41-018101

116-83-328-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-83-328-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-318-41-801101

110-83-318-41-801101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-83-318-41-801101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-3513-10

18-3513-10

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-3513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-6513-11

10-6513-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-6513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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