IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
A-CCS 084-Z-SM

A-CCS 084-Z-SM

CONN SOCKET PLCC 84POS TIN

Assmann WSW Components

392 -
A-CCS 084-Z-SM

数据表

- Tube Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
A-CCS 020-G-T

A-CCS 020-G-T

CONN SOCKET PLCC 20POS GOLD

Assmann WSW Components

265 -
A-CCS 020-G-T

数据表

- Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
XR2C1011N

XR2C1011N

CONN SOCKET SIP 10POS GOLD

Omron Electronics Inc-EMC Div

395 -
XR2C1011N

数据表

XR2 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
24-6518-10

24-6518-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

185 -
24-6518-10

数据表

518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
D2824-42

D2824-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

2,434 -
D2824-42

数据表

D2 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
917-47-208-41-005000

917-47-208-41-005000

CONN SOCKET TRANSIST TO-5 8POS

Mill-Max Manufacturing Corp.

174 -
917-47-208-41-005000

数据表

917 Tube Active Transistor, TO-100 8 (Round) - Gold Flash Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-47-328-41-001000

110-47-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

168 -
110-47-328-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-314-SST

ICA-314-SST

CONN IC DIP SOCKET 14POS GOLD

Samtec Inc.

316 -
ICA-314-SST

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
8452-21A1-RK-TP

8452-21A1-RK-TP

CONN SOCKET PLCC 52POS TIN

3M

577 -
8452-21A1-RK-TP

数据表

8400 Tube Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
69802-444LF

69802-444LF

CONN SOCKET PLCC 44POS TINLEAD

Amphenol ICC (FCI)

1,726 -
69802-444LF

数据表

69802 Tape & Reel (TR) Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead 150.0µin (3.81µm) Phosphor Bronze Surface Mount Open Frame Solder 0.050" (1.27mm) Tin-Lead 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 125°C
ICA-324-STT

ICA-324-STT

CONN IC DIP SOCKET 24POS TIN

Samtec Inc.

612 -
ICA-324-STT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
210-93-316-41-001000

210-93-316-41-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

354 -
210-93-316-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-632-41-001000

110-99-632-41-001000

CONN IC DIP SOCKET 32POS TINLEAD

Mill-Max Manufacturing Corp.

186 -
110-99-632-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-314-41-003000

115-93-314-41-003000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

130 -
115-93-314-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-43-103-41-001000

917-43-103-41-001000

CONN TRANSIST TO-5 3POS GOLD

Mill-Max Manufacturing Corp.

351 -
917-43-103-41-001000

数据表

917 Tube Active Transistor, TO-5 3 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-87-628-41-117101

114-87-628-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

104 -
114-87-628-41-117101

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-308-SGG

ICA-308-SGG

CONN IC DIP SOCKET 8POS GOLD

Samtec Inc.

138 -
ICA-308-SGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
A-CCS 032-G-T

A-CCS 032-G-T

CONN SOCKET PLCC 32POS GOLD

Assmann WSW Components

918 -
A-CCS 032-G-T

数据表

- Tube Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
D2822-42

D2822-42

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.

1,057 -
D2822-42

数据表

D2 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
110-47-632-41-001000

110-47-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

262 -
110-47-632-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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