IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
214-99-624-01-670800

214-99-624-01-670800

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.

307 -
214-99-624-01-670800

数据表

214 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-308-31-012000

614-93-308-31-012000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

284 -
614-93-308-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-308-31-012000

614-43-308-31-012000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

261 -
614-43-308-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
D2828-42

D2828-42

CONN IC DIP SOCKET 28POS GOLD

Harwin Inc.

229 -
D2828-42

数据表

D2 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
D2928-42

D2928-42

CONN IC DIP SOCKET 28POS GOLD

Harwin Inc.

193 -
D2928-42

数据表

D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
24-4518-10

24-4518-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

508 -
24-4518-10

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
210-43-624-41-001000

210-43-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

158 -
210-43-624-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-422-41-003000

115-43-422-41-003000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

1,873 -
115-43-422-41-003000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-320-41-001000

115-43-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

232 -
115-43-320-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-87-642-41-005101

117-87-642-41-005101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

522 -
117-87-642-41-005101

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-320-41-008101

116-87-320-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

360 -
116-87-320-41-008101

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
XR2A-1801-N

XR2A-1801-N

CONN IC DIP SOCKET 18POS GOLD

Omron Electronics Inc-EMC Div

151 -
XR2A-1801-N

数据表

XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
111-43-320-41-001000

111-43-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

200 -
111-43-320-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-43-210-41-005000

917-43-210-41-005000

CONN SOCKET TRANSIST TO100 10POS

Mill-Max Manufacturing Corp.

313 -
917-43-210-41-005000

数据表

917 Tube Active Transistor, TO-100 10 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
D2924-42

D2924-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

225 -
D2924-42

数据表

D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
D2832-42

D2832-42

CONN IC DIP SOCKET 32POS GOLD

Harwin Inc.

577 -
D2832-42

数据表

D2 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
ICA-628-STT

ICA-628-STT

CONN IC DIP SOCKET 28POS TIN

Samtec Inc.

8 -
ICA-628-STT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICA-324-SST

ICA-324-SST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

748 -
ICA-324-SST

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
4591

4591

CONN TRANSIST TO-5 4POS TIN

Keystone Electronics

1,844 -
4591

数据表

- Bulk Active Transistor, TO-5 4 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
16-0518-00

16-0518-00

CONN SOCKET SIP 16POS GOLD

Aries Electronics

167 -
16-0518-00

数据表

518 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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